Company Profile

BIWIN Storage Technology Company Limited (Stock Symbol: 688525) produces high quality flash storage and is now known in OEM/ODM, consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.

 

BIWIN's experience in manufacturing includes its complete packaging, testing, and production lines at its latest 110,000 m2 facility, BIWIN Huizhou Science and Technology Zone. This state-of-the-art facility houses all the latest production equipment for assembly, packaging, testing and mass production-- including wafer receiving optical inspection, wafer taping, laser stealth dicing, wafer back grinding, wafer expander, wafer laser grooving, wafer saw, die bonding, plasma cleaning, wire bonding and post-bonding AI inspection, wire bond pull testing, compression molding, laser marking, solder ball mounting, package singulation, and automated optical inspection and ball scan.

 

For embedded computing, we make eMMC, eMCP, ePOP, uMCP, BGA SSD, UFS, DDR, LPDDR and small capacity storage. Our Advanced Packaging can squeeze 16 layers Die into our PCIe 4.0 BGA SSD bringing full SSD functionality to a single eSSD chip. For industrial control we make fast and reliable SSDs (SATA 2.5", SATA M.2, NVMe M.2, mSATA) and memory (DDR4, DDR5, memory cards, DOM Series and more.) For consumers, BIWIN products earn top global press reviews for SATA 2.5", PCIe M.2, SATA M.2, and portable SSDs, as well as DDR4, DDR5 memories and memory cards.

 

From the core to the intelligent edge, BIWIN offers the wide range of flash storage that suits the world's largest industries.

 

1) A complete project management system was established to form a closed loop covering all processes from demand to delivery in order to boost BIWIN's overall competitiveness.

 

2) BIWIN continues to improve the R&D system featuring collaborative cooperation and technology sharing, creating a better platform and management model for core technology, and ensuring that our designs are closely related to our experiences.

 

 

1) BIWIN Huizhou is expected to pack 120,000pcs of 12-inch wafers per month.

 

2) Makes concerted efforts through investment and cooperation to ensure delivery on time.

 

 

1) BIWIN is a leading actor in entering the world's TOP supply chains, gaining abundant experience in delivering both general and customized products.

 

2) BIWIN is one of the memory chips suppl ier that boasts greater credibility of mainstream SOC platforms.

 

 

1) BIWIN's competitive edge in core technology, development, quality and productivity owes much to its operation model featuring partial vertical integration.

 

2) MES 4.0 was introduced to achieve product life cycle management of each Die.

 

3) For special automation requirements, BIWIN applies the controlled BOM in the manufacturing process.