BIWIN eMCP

eMCP

As the capacity of smart phone operating system and applications increases, especially with the increasing popularity of the Android operating system, smart phones have higher requirements of storage capacity. BIWIN’s eMCP is based on MCP (Multi-Chip Packaging), which integrates an eMMC chip and a low-power DRAM solution into once IC package, effectively simplifying the manufacturing process and development cost of customers' products and shortening the development time of their products, thereby speeding up the launch of end products.

Product specifications
Interface eMMC+LPDDR4X
Dimension 11.5x13x1.0mm/11.5x13x1.2mm
Max. Sequential Read
Max. Sequential Write
Density 32GB+32Gb/64GB+32Gb
Approved Verification Platform Spreadtrum:7731E;9832E;9820E;SC9850K;SC7731C;SC7731G;SC8825; SC9820;SC9832;SC9832A;SC9832E;SC9850;SC9853;SC9863A
Qualcomm:8909; APQ8009W; MSM8909W
MediaTek:MT6580; MT6735; MT6737; MT6739; MT6761; MT6570; MT6570N; MT6572; MT6735; M6735M; MT6737T
Operating Voltage eMMC:1.2V, 1.8V and 3.3V
Low power DDR4/4X:VDD1=1.8V; VDD2=VDDCA=VDDQ=1.2V VDD1=1.8V; VDD2=1.1V; VDDQ=1.1V or 0.6V
Operating Temperature -20℃~85℃
Packaging FBGA254
Application Vehicle-Mounted Multimedia Terminal / Smart Phone
选型信息

32GB+32Gb

BWCC2KD6-32G

 

64GB+32Gb

BWCC2KD6-64G