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Japan IT Week 2023 BIWIN Brings Reliable Storage Solutions for Industries

Date:2023/03/27 Read:926

BIWIN Showcase Best-in-Class Embedded Memory Chips and Industrial Storage Solutions at Japan IT Week Spring 2023

Shenzhen, China, March 27th, 2023 – During Japan IT Week Spring 2023, BIWIN Storage Technology will show their cutting-edge embedded and industrial memory solutions to meet the needs of today's most demanding applications for devices, edge computing, PC, industrial automation, in-vehicle systems, IoT, digital signage, server systems and smart mobile terminals. Japan IT Week Spring 2023 runs April 5th-7th in Tokyo and BIWIN can be found at Hall 5 E45-26.

Embedded Memory: With up to 1 TB capacity, the BIWIN PCIe Gen4 BGA SSD EP400 comes with the high-speed PCIe 4.0 x 2 to deliver up to 3500 MB/s read and 3300 MB/s write -- with dimensions of just 11.5 mm (L) x 13 (W) mm. Coupled with LPDDR4X, this BIWIN EP400 can run at speeds up to 4266 Mbps with a capacity up to 64 GB.

With the anticipated demand in 2023 (and beyond) for embedded devices, edge computing, ARM in servers, PCs and mobile devices, BIWIN anticipates a great reception to its lines of BGA SSD solutions built to improve performance with ARM servers and ARM-embedded devices including gaming smartphones, ultra-thin laptops, automotive, and smart industrial equipment.


DDR5 Memory: BIWIN DDR5 UDIMM integrates power efficiency, wide operating temperature range and high capacity to deliver an unparalleled transfer rate up to 4800 MT/s. Strictly screened DRAM ICs are used to ensure stable operation and excellent compatibility, making this product the best choice for industrial control, security and protection, desktop PCs and more. BIWIN DDR5 SODIMM is a low-power, high-performance product that fully conforms to JEDEC's 262-pin DDR5 small size memory module. With a capacity range of 16 GB – 32 GB and up to 4800 MT/s data transfer speed, DDR5 SODIMM suits computer and gaming laptops, NUCs, thin clients, security and protection devices and more.

BIWIN C1008 In-vehicle SSD

In-vehicleBIWIN C1008 is specially manufactured for in-vehicle surveillance systems and DVR (Digital Video Recorders). Crafted with 3D TLC flash, BIWIN C1008 is available in 500 GB, 960 GB, 1.92 TB, and 3.84 TB. It provides stable reading and writing, more than 3000 P/E cycles, "firmware algorithm + tantalum capacitor" dual power failure protection, wide temperature technology-- which enables a smooth and stable workflow even when input-intensive.

BIWIN C1008 In-vehicle SSD

Enterprise ServerBIWIN SSD SS321 is a pioneering product built with 3D NAND wafer bundled with SATA 6 Gbps interface and DDR4 external DRAM cache, delivering a maximum sequential 560 MB/s read and 500 MB/s write. It has three volume options: 240 GB, 480 GB, and 960 GB. Made with cutting-edge hardware design, firmware development, packaging & testing, and manufacturing process, these products sport excellent performance, high reliability, reliable security, low power consumption and more.

Meet us at Japan IT Week Spring 2023 to check out BIWIN's industry-leading products featuring strong performance, lower power consumption, great reliability, and larger capacities to meet your storage needs.

Japan IT Week 2023


BIWIN Storage Technology Company Limited produces high quality flash storage and is now known in consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware and storage algorithms.

BIWIN’s experience in production (along with its complete packaging, testing, and production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products.

At the end of 2021, the company opened its latest facility, BIWIN Huizhou Science and Technology Zone, with a state-of-the-art R&D lab and 110,000 m2 of production.

Our founders started in the flash storage business in Shenzhen, China in 1995, embracing the "WIN-WIN" business philosophy that would later become the hallmark for BIWIN. In 2009 they made a key decision for the business: to add IC encapsulation (or IC packaging) process into the factory. A remarkable milestone that the vast majority of competing companies still don't have (they outsource the process or buy the packaged IC). This successful step led to the 2010 creation of the company we know today, BIWIN Storage Technology Company.

To learn more about BIWIN Technology visit or contact us

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