BIWIN LPDDR5 uMCP Empowers Smartphone with Extreme Speed
Author:BIWIN Storage Technology
Leveraging LPDDR5 technology, BIWIN’s uMCP product integrates LPDDR5 and UFS 3.1, delivering impressive sequential read and write speeds of up to 2100 MB/s and 1800 MB/s, respectively. With a high-frequency rate of 6400 Mbps and a capacity of up to 8 GB + 256 GB, this chip maintains a compact size, measuring as small as 11.5 x 13.0 x 1.0 mm. Compared to separate UFS 3.1 and LPDDR5 configurations, this integrated solution saves a significant 55% of motherboard space, facilitating more flexible designs for smartphone systems.