UFS

UFS

As a next-generation embedded memory chip, the BIWIN UFS chip is three times faster than the latest eMMC 5.1 standard. In addition, UFS 2.1's faster performance could effectively ensure the safe transmission of data without unnecessary lag caused by reading and writing operations, which is the key to the higher speed achieved in UFS 2.1. In addition to its huge advantages in transfer speed, BIWIN UFS 2.1 also has excellent power consumption characteristics.

Product specifications
Interface UFS2.1
Dimension 11.50×13.00×1mm
Max. Sequential Read 800MB/s
Max. Sequential Write 260MB/s
Density 32GB~512GB
Approved Verification Platform Qualcomm:835;845;
Operating Voltage VCC=3.3V,VCCQ=1.8V
Operating Temperature -20℃~85℃
Packaging FBGA153
Application Notebook / Smart Phone
选型信息

32GB

UFB2752Q12N-32G

 

64GB

UFB2752Q12N-64G

 

128GB

UFB2752Q12N-128G