BIWIN ePOP

ePOP

BIWIN ePOP combines MMC and Mobile LPDDR in a single package, with different capacities. These products are widely used in mobile and wearable applications. With leading wafer packaging technologies, including advanced wafer grinding, lamination and wirebonding techniques, BIWIN integrates RAM and ROM in a single device, which not only improves performance and energy efficiency, but also saves space on printed circuit boards (PCB), thus shortening the development time for customers.
Thanks to such characteristics in a small form factor, low power consumption, low cost, and simple development process, BIWIN ePOP is an ideal solution for portable and wearable devices, such as smartphones, tablets, PMP, PDA and other media devices.

Application

Product specifications
Interface eMMC:eMMC 5.0;
LPDDR 2/3:LPDDR 32bit I/F
Dimension 10mm × 10mm × 0.9mm
Max. Sequential Read 80MB/sec (Max.)
Max. Sequential Write 20MB/sec (Max.)
Density 4GB+4Gb/8GB+4Gb
Approved Verification Platform SnapDragon Wear 3100 ;
MSM8909W
Operating Voltage eMMC:VCC=3.3V,VCCQ=1.8V;
LPDDR 2/3:VDD1=1.8V; VDD2=VDDCA=VDDQ=1.2V
Operating Temperature -20℃~85℃
Packaging BGA136
Application Smart Wear
BIWIN ePOP

4+4

BWCD24L-04G

 

8+4

BWCD24M-08G