BGA SSD

BWS3BTCDC-XXG

BIWIN eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging. Supports SATA 3.1 specification. By combining advanced NAND flash with SSD controller and flash management technology, eSSD provides higher and reliable performance. SATA is the most popular and mature interface for large-capacity storage devices. BIWIN eSSD is compliant with SATA protocol and is exclusively designed for devices that support the SATA interface.
BIWIN eSSD is characterized by its low power consumption and since it's a non-volatile memory device, it can maintain stored data without power supply. It also has a wide range of operating temperature, high shock and vibration tolerance.

Application

Product specifications
Interface SATA III
Dimension 16.00× 20.00×1.4mm
Max. Sequential Read 470MB/s
Max. Sequential Write 350MB/s
Density 32GB ~ 256GB
Approved Verification Platform
Operating Voltage VCC=3.3v,VCCQ =1.8v, VCCK=1.1 V
Operating Temperature Consumer grade:-20℃~70℃
Industrial grade:-40℃~85℃
Packaging FBGA157
Application Notebook
选型信息

60GB

BWS3BTCDC-60G

 

120GB

BWS3BTCDC-120G

 

240GB

BWS3BTCDC-240G


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