CXL, an advanced interconnect technology, facilitates high-bandwidth, low-latency connections between host processors and devices like accelerators and memory buffers. It addresses the "memory wall" challenge, ensuring consistency between CPU/GPU memory and connected device memory, enhancing heterogeneous computing performance. CXL, built upon PCIe interfaces, supports memory expansion beyond DIMM slots, overcoming the latency gap between main memory and SSD storage. It is crucial for AI applications, offering increased memory capacity and bandwidth, and contributing to high-performance computing. 

Recently, BIWIN successfully launched CXL 2.0 DRAM memory modules. BIWIN's CXL 2.0 DRAM adopts the EDSFF (E3.S) form factor with a memory capacity of up to 96 GB. It also supports a PCIe 5.0 × 8 interface, achieving a theoretical bandwidth of up to 32 GB/s. These modules can be directly connected to backplanes and server motherboards supporting the CXL specification and the E3.S interface, expanding server memory capacity and bandwidth. Additionally, BIWIN can provide CXL AIC adapter cards for server backplanes without E3.S.
 
Features and Advantages:
 

• Equipped with a high-performance memory expansion controller, compliant with CXL 2.0 Type 3 standards, supporting PCIe 5.0 x 8 interface with a theoretical bandwidth of up to 32 GB/s.
• Premium DDR5 ICs and capacities of up to 96 GB.
• Supports On-Die ECC, Side-Band ECC, SDDC, SECDED.
• Allows up to 16 hosts to simultaneously access different memory sections, and supports pooling and sharing.
• Simultaneously releases an open-source CXL DRAM software toolkit to ensure seamless deployment of CXL extended memory for users. Toolkit features: provides CXL display, and implicit API, and allows customers to use it based on different application scenarios; offers application-level CXL NUMA tool usage methods to establish an intuitive understanding at the application level of the benefits of CXL.

Regarding latency performance, during actual testing, the BIWIN CXL 2.0 DRAM, mounted on Node 2, exhibits a latency of 247.1 ns for CPU access compared to Node 0. With a bandwidth exceeding 21 GB/s, it demonstrates excellent latency performance, empowering high-speed data processing.

Artificial Intelligence (AI) and Machine Learning (ML) continue to drive the growing demand for high-speed data processing. BIWIN CXL 2.0 DRAM combines support for memory capacity and bandwidth expansion, memory pooling and sharing, high bandwidth, low latency, and high reliability, empowering AI high-performance computing. Currently, BIWIN offers functional prototypes of 32 GB to 96 GB CXL 2.0 DRAM for joint evaluation and testing by customers and partners. In the future, BIWIN will remain focused on CXL technology to meet the demands of high-performance computing.
 
AIC Adapter Card
 
For server backplanes without E3.S, BIWIN provides Adapter-In-Card (AIC) adapter cards, enabling CXL RDIMM memory expansion for servers.