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BIWIN U.2 PCIe SSD

33S1-D/PL/E2E

BIWIN’s enterprise-level 2.5-inch U.2 SSD is equipped with an 8-channel PCIe master control, whose transmission channel is PCIe Gen3 x 4 (32Gb/s) which supports the latest NVMe 1.3 protocol. Adopting 3D flash particles, it has better performance and stability, and used together with the LDPC error correction algorithm, its durability is increased several times. Supports end-to-end Data Protection and SRAM ECC Data Protection. The U.2 interface is mainly designed for standard desktops, workstations, and servers, especially for the enterprise-level application market.


Feature

1.Capacity: 3D NAND :120GB~2TB

2.SFF-8639 U.2 Interface,PCIe G3X4 NVMe1.3

3.3D NAND+LDPC ECC Algorithm

4.Support Dynamic Power Management

5.Support Trim、NCQ、SMART

6.Support Global Wear Leveling

7.Support Active and Passive Garbage Collection

8.Support Power Loss Protection

9.Support end to end data protection


Specifications

Product specifications
Model U.2 PCIe 33S1-D/PL/E2E SSD
Interface SFF-8639 U.2 PCIe G3/NVMe1.3
FLASH Type TLC
Capacity 120GB~2TB
Channel 8
Seq. Read/Write(MB/s,Max) 3064/1763
Power Consumption 7.2W(12Vx600mA)
Thermal Sensor Support
External Cache Support
Firmware Backup Support
TRIM Support
ATA Encryption Support
S.M.A.R.T Monitoring Support
AES 256-Bit Optional
Power-off Protection Optional
Quick Erase
Physical Destruction
Working Temperature 0~70℃
Environment Temperature Shock:20G@7~2000Hz/Impact:1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF:>3 million hours
Size 100.00 x 70.00 x 9.00mm
Application Server Storage / Special Industrial Applications / Monitor
Technical Features Underfill / AES Encryption / Firmware Backup / Anti-Vulcanization Technology / Wear Levelling / Write-Protection / V-REC / Garbage Collection&TRIM / End-to-end Data Protection / Anti-Vulcanization Technology / Thermal Sensor