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2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 1)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 2)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 3)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 4)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 1)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 2)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 3)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD(image 4)
2.5" / mSATA / M.2 2280 / M.2 2280 SATA SSD

BIWIN GS30 Series

BIWIN GS30 series SSD adopts SATA III interface and are equipped with fully self-developed firmware. The maximum sequential read and write speed reaches 560 MB/s and 520 MB/s respectively. The full-disk write speed remains at 450 MB/s and its capacity can reach up to 2 TB. The series product supports operating temperatures from -40 to 85 . Mean Time Between Failures (MTBF) is longer than 3 million hours.

 

BIWIN GS30 series SSD adopt Cornerfill and anti-sulfurization. It also supports power-loss data protection, data inspection, End-to-end protection, data destruction and other functions, ensuring the data integrity and storage reliability in extreme environment.


Feature

1. Static and dynamic wear leveling algorithm
2. Garbage collection and TRIM
3. Supports dynamic power management
4. Supports TRIM, NCQ, and S.M.A.R.T.
5. Supports quick erasure (logical destruction)


Specifications

Product specifications
Model 2.5" / mSATA / M.2 2280 / M.2 2242 SATA SSD
Interface SATAⅢ 6 Gbps
Flash Type 3D TLC
Capacity 128 GB to 2 TB
Channel 2
Max. Sequential Read / Write 560 / 520 MB/s
Power Consumption 1.25 W
Thermal Sensor Support
External Cache /
Firmware Backup Support
TRIM Support
ATA Encryption Support
S.M.A.R.T Monitoring Optional
AES 256-Bit /
Power-off Protection /
Quick Erase Support
Physical Destruction /
Working Temperature -40 ℃ to 85 ℃
Environment Temperature -40 ℃ to 85 ℃
Dimensions 2.5 Inch: 100.0 x 69.8 x 7.0 mm / M.2 2280: 22.0 x 80.0 x 2.3 mm / M.2 2242: 22.0 x 42.0 x 3.5 mm / mSATA: 50.8 x 29.85 x 4.85 mm
Technical Features Underfill / Firmware Backup / Wear Levelling / Garbage Collection & TRIM