Author：BIWIN
BIWIN provides an innovative PCIe BGA SSD+LPDDR4X storage solution for ARM servers.
Author：BIWIN
BIWIN provides high-efficient eMCP and ePOP storage solutions to make smart terminal applications small in size and excel in performance.
Author：BIWIN
Recently, Mr. Chen Huijun, Secretary-General of Shenzhen Automotive Electronics Industry Association, visited BIWIN, and awarded the plaque of the vice-chairman unit. Mr. Sam Sun, Chairman of BIWIN, and Mr. Cai, Deputy General Manager treated Mr. Chen cordially, and the two parties had in-depth exchanges on the development of the association, the prospects of the industry, and the trend of automotive storage.
Author：BIWIN
BIWIN Storage Wins Top Achiever Award for a Leading Manufacturer of Consumer Storage
Author：BIWIN
California, U.S.A., Aug 2-4, 2022 — At Flash Memory Summit 2022 Booth 619, BIWIN Storage Technology Co., Ltd. will show its wide-ranging embedded memory and industrial solutions portfolio designed to meet the increased demand for complex memory and storage needs.
Author：BIWIN
BIWIN launched its new BS321 4TB SATA SSD recently. Featuring the SATA 6Gb/s interface, this BS321 adopts Xtacking 2.0 Gen3 3D TLC NAND chip and DDR4 DRAM to deliver top-notch performance. Integrated with MAXIO’s MAS0901 and BIWIN’s own firmware, it hits sequential read, write speeds up to 550MB/s and 470MB/s respectively.
Author：BIWIN
NUREMBERG, Germany, June 21-23rd, 2022 — At Embedded World 2022 Hall 1-241, BIWIN Technology LLC, Inc. showed its embedded memory and industrial solutions portfolio to meet increased demand for complex memory and storage needs at the intelligent edge.
Author：BIWIN
BIWIN has rolled out its SS321 SATA 2.5-inch SSDs for servers. These products help customers to forge a sound cloud computing center, server system, network security equipment, etc. They enjoy vast vistas in government, finance, operators, enterprise data centers, and more.
Author：BIWIN
The Apple M1 chip has a prominent edge for its superior performance per watt. It can stack up against the peak performance of competitive PC processors via using only one-quarter of its power consumption. With the advanced manufacturing processes,
Author：BIWIN
EMMC and UFS are mainly used in intelligent mobile terminals. They call for proper capacity and performance and are stringent on power consumption and volume. SSDs are principally utilized in PCs and servers, requiring large capacity (100 GB to TB level), extremely high concurrency to improve performance
Author：BIWIN
The PC OEM market has always been a crucial battlefield for memory manufacturers. In 2021, regarding consumer SSDs, the PC OEM market boasted the largest shipments, accounting for about 62%. In Q1 of 2022, Intel's next-generation Alder Lake processor shipments did not live up to the expectation
Author：BIWIN
BIWIN RD100 series DDR4 RDIMM server memory modules with the capacity of 32 GB and 16 GB have passed the AVL certification of Intel Authorized Laboratory.
Author：BIWIN
In pursuit of the extremely slim feature, traditional mobile intelligent terminals generally adopt eMMC/UFS embedded memory. Two-in-one computers, Ultrabooks and more are defined to production tools. Given that, eMMC is blamed for performance bottleneck, UFS is blamed for limited application platforms, and ordinary SSDs are blamed for large size and high power consumption. Meanwhile, these headaches have engendered the BGA SSD equipped with the PCIe standard interface.
Author：BIWIN
BIWIN C1004 is compliant with car-level standards, featuring superb quality, outstanding performance, and high durability. At present, it has been stably supplied to many important domestic car manufacturers.
Author：BIWIN
BIWIN wins the World Electronics Achievement Award "Memory of the Year" for its memory chip ePOP E100 at the 2021 Global CEO Summit.
