Company Profile

BIWIN Storage Technology Co., Ltd. (Stock Symbol: 688525), established in 2010, specializes in the research, design, packaging and testing, production, and sales of semiconductor storage and memory products. Its primary offerings include semiconductor memory products and advanced packaging and testing services. Based on application fields, its products are categorized into embedded, PC, industrial and automotive-grade, enterprise-grade, mobile and more storage solutions.

With the mission of “Storage Empowers Everything,” the company is dedicated to becoming a world-class provider of storage solutions and advanced packaging and testing services. Recognized as a listed company on the STAR Market and a component stock of the STAR 50 Index, BIWIN has received strategic investments from the National Integrated Circuit Industry Investment Fund Phase II, China Internet Investment Fund, and the Chinese Academy of Sciences Venture Capital.

With a strong focus on semiconductor memory industry chain, the company has established a business model of integrated R&D and packaging and testing and demonstrated core competencies in storage medium research, firmware algorithm development, memory chip packaging and testing, testing research and development, and global brand management. Meanwhile, BIWIN is also actively expanding footprints in more technological sectors including IC design, advanced packaging and testing, and chip testing equipment R&D. Its storage products are now widely used in information technology fields such as mobile smart terminals, PCs, industrial terminals, data centers, intelligent vehicles, and mobile storage.

By right of outstanding comprehensive competitiveness, BIWIN has been honored with titles including “STAR 50 Index Constituents”, “2024 Most Valuable Sci-Tech Innovation Board Listed Company”, “National Specialized, Refined, Special and Innovative ‘Little Giant’ Enterprise,” “National High-Tech Enterprise,” “AEO Advanced Certified Enterprise,” “Top 10 Domestic Storage Chip Manufacturers,” “Guangdong Complex Memory Chip R&D, Packaging and Testing Engineering Technology Research Center,” “Shenzhen Postdoctoral Innovation Practice Base,” “Shenzhen Well-Known Brand,” and “Shenzhen Nanshan District’s Top 10 Specialized and Sophisticated Enterprises in Value Added.” Its products have received accolades such as the “World Electronics Achievement Award ‘Memory of the Year’,” “China IC Design Achievement Award ‘Best Memory of the Year’,” “Top Embedded Memory Chips in China,” and “Excellent Auto Electronic Innovation Product Award.”

1) A complete project management system was established to form a closed loop covering all processes from demand to delivery in order to boost BIWIN's overall competitiveness.

 

2) BIWIN continues to improve the R&D system featuring collaborative cooperation and technology sharing, creating a better platform and management model for core technology, and ensuring that our designs are closely related to our experiences.

 

 

1) BIWIN Huizhou is expected to pack 120,000pcs of 12-inch wafers per month.

 

2) Makes concerted efforts through investment and cooperation to ensure delivery on time.

 

 

1) BIWIN is a leading actor in entering the world's TOP supply chains, gaining abundant experience in delivering both general and customized products.

 

2) BIWIN is one of the memory chips supplier that boasts greater credibility of mainstream SOC platforms.

 

 

1) BIWIN's competitive edge in core technology, development, quality and productivity owes much to its operation model featuring partial vertical integration.

 

2) MES 4.0 was introduced to achieve product life cycle management of each Die.

 

3) For special automation requirements, BIWIN applies the controlled BOM in the manufacturing process.