BIWIN ePOP combines MMC and Mobile LPDDR in a single package, with different capacities. These products are widely used in mobile and wearable applications. With leading wafer packaging technologies, including advanced wafer grinding, lamination and wirebonding techniques, BIWIN integrates RAM and ROM in a single device, which not only improves performance and energy efficiency, but also saves space on printed circuit boards (PCB), thus shortening the development time for customers.
Thanks to such characteristics in a small form factor, low power consumption, low cost, and simple development process, BIWIN ePOP is an ideal solution for portable and wearable devices, such as smartphones, tablets, PMP, PDA and other media devices.
| Interface |
eMMC: eMMC 5.0 / eMMC 5.1 LPDDR 2 / LPDDR 3: 32bit LPDDR 4 / LPDDR 4x: 16bit |
|---|---|
| Dimensions |
10.0 × 10.00 mm (136b) 8.00 × 9.50 mm (144b) 8.60 × 10.40 mm (144b) 12.00 × 13.00 mm (320b) |
| Max. Sequential Read | eMMC: 320 MB/s |
| Max. Sequential Write | eMMC: 260 MB/s |
| Frequency |
LPDDR 2 / LPDDR 3: 1200 MHz LPDDR 4x: 1200 MHz - 1866 MHz |
| Capacity |
4 GB + 4 Gb 8 GB + 4 Gb / 8 GB + 8 Gb 16 GB + 8 Gb 32 GB + 16 Gb 64 GB + 16 Gb |
| Working Voltage |
eMMC: VCC=3.3 V, VCCQ=1.8 V LPDDR 2 / LPDDR 3: VDD1=1.8 V, VDD2=VDDCA=VDDQ=1.2 V LPDDR 4: VDD1=1.8 V, VDD2=VDDQ=1.1 V LPDDR 4x: VDD1=1.8 V, VDD2=1.1 V, VDDQ=0.6 V |
| Working Temperature | -20℃ - 85℃ |
| Approved Verification Platforms |
SnapDragon Wear 3100 / 5100 MSM8909W... |
| Packaging | FBGA136 / FBGA144 / FBGA320 |
| Application | Smart Wear |
|
4+4 |
BWCD24L-04G |
|
|---|---|---|
|
8+4 |
BWCD24M-08G |
