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BIWIN ePOP(image 1)
BIWIN ePOP(image 1)
BIWIN ePOP

ePOP

BIWIN ePOP combines MMC and Mobile LPDDR in a single package, with different capacities. These products are widely used in mobile and wearable applications. With leading wafer packaging technologies, including advanced wafer grinding, lamination and wirebonding techniques, BIWIN integrates RAM and ROM in a single device, which not only improves performance and energy efficiency, but also saves space on printed circuit boards (PCB), thus shortening the development time for customers.
Thanks to such characteristics in a small form factor, low power consumption, low cost, and simple development process, BIWIN ePOP is an ideal solution for portable and wearable devices, such as smartphones, tablets, PMP, PDA and other media devices.

Application

Product specifications
Interface eMMC: eMMC 5.0 / eMMC 5.1
LPDDR 2 / LPDDR 3: 32bit
LPDDR 4 / LPDDR 4x: 16bit
Dimensions 10.0 × 10.00 mm (136b)
8.00 × 9.50 mm (144b)
8.60 × 10.40 mm (144b)
12.00 × 13.00 mm (320b)
Max. Sequential Read eMMC: 320 MB/s
Max. Sequential Write eMMC: 260 MB/s
Frequency LPDDR 2 / LPDDR 3: 1200 MHz
LPDDR 4x: 1200 MHz - 1866 MHz
Capacity 4 GB + 4 Gb
8 GB + 4 Gb / 8 GB + 8 Gb
16 GB + 8 Gb
32 GB + 16 Gb
64 GB + 16 Gb
Working Voltage eMMC: VCC=3.3 V, VCCQ=1.8 V
LPDDR 2 / LPDDR 3: VDD1=1.8 V, VDD2=VDDCA=VDDQ=1.2 V
LPDDR 4: VDD1=1.8 V, VDD2=VDDQ=1.1 V
LPDDR 4x: VDD1=1.8 V, VDD2=1.1 V, VDDQ=0.6 V
Working Temperature -20℃ - 85℃
Approved Verification Platforms SnapDragon Wear 3100 / 5100
MSM8909W...
Packaging FBGA136 / FBGA144 / FBGA320
Application Smart Wear
BIWIN ePOP

4+4

BWCD24L-04G

 

8+4

BWCD24M-08G