Author：BIWIN Storage Technology
BIWIN released brand-new industrial-grade wide-temperature TGE408 eMMC, which is engineered with self-developed controller, built-in in-house firmware algorithms and domestic NAND Flash with full-process localization from IC design to tapeout and wafer manufacturing. In FBGA 153 Ball package, it follows eMMC 5.1 protocol, supports HS400 high-speed mode and operates under the temperature range from -40℃ to 85℃. Meanwhile, it’s equipped with exclusive Win-pSLC ultra-stable and endure architecture for balanced performance, reliability and durability, perfect for stability-critical areas such as power energy and industrial automation.
Author：BIWIN Storage Technology
Recently, the 2026 International IC & Component Exhibition and Conference (shortened as IIC), hosted by Aspencore, successfully concluded in Shanghai. At the concurrent 2026 China IC Design Awards Ceremony, BIWIN Mini SSD was honored with the “Memory of the Year” award. This recognition not only affirms the product’s technological innovation and commercial value, but also highlights BIWIN’s continued leadership and long-term commitment to advancing the memory industry.
Author：BIWIN Storage Technology
Recently, the 2026 Nanshan Enterprise Gala was successfully held at Shenzhen Bay Sports Center. Senior officials from Shenzhen City and Nanshan District attended the event, joining leading entrepreneurs and executives to celebrate this annual occasion. During the ceremony, the 2025 Nanshan Enterprise Honor List was unveiled, where BIWIN Storage Technology Co., Ltd. was recognized as one of the prestigious “Top 10 Rooted in Nanshan.” This accolade highlights the company’s sustained commitment to long-term development, as well as its outstanding achievements in technological innovation, growth momentum, and corporate responsibility.
Author：BIWIN Storage Technology
At Embedded World 2026, the world’s leading exhibition for embedded technologies held from March 10–12 in Nuremberg, BIWIN showcased its comprehensive portfolio of storage solutions and core technologies. Among the highlights, BIWIN ePoP5X was honored with the prestigious “Best-in-Show” Award, recognizing its breakthrough innovation and optimized performance for AI edge applications.
Author：BIWIN Storage Technology
BIWIN Spec, the industrial-grade and automotive-grade storage brand under BIWIN, has been recognized on the prestigious 2025 Industry Contribution List. The honor was awarded in C114’s 2025 AI+ “Hardcore” List selection for its innovative “AI + Datacom Industrial-Grade Storage Solution.”
Author：BIWIN Storage Technology
The “Mini SSD Strategic Seminar” convened recently to strengthen collaboration and accelerate ecosystem development following the successful “Mini SSD Ecosystem Application Seminar” held in Shenzhen on January 26.
Author：BIWIN Storage Technology
On January 26, 2026, the “From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar”, jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater Bay Area Innovation Center in Shenzhen.
Author：BIWIN Storage Technology
BIWIN Storage (SSE STAR Market: 688525) has been recognized as an OpenCloudOS “2025 Outstanding Ecosystem Partner”, honoring its strong technical capabilities and sustained collaboration within the enterprise storage ecosystem.
Author：BIWIN Storage Technology
Recently, Guangdong–Hong Kong–Macao Greater Bay Area Distribution Network New Equipment Technology Forum & Standard Release Conference was successfully held in Zhuhai. Focusing on intelligent upgrades of power distribution networks and innovation in equipment technologies, the forum aims to accelerate the high-quality development of energy infrastructure.
Author：BIWIN Storage Technology
Recently, BIWIN’s innovative product Mini SSD was honored with multiple international awards at CES 2026, earning the TWICE 2026 Picks Awards Winner as well as the AVRONA Most Innovative Award.
Author：BIWIN Storage Technology
With the maturation of on-device AI computing, multimodal perception fusion, and reinforcement learning frameworks, robots are evolving from being merely reactive to becoming truly adaptive, with requirements of accumulating experience to achieve autonomous evolution, far beyond just executing commands.
Author：BIWIN Storage Technology
Recently, the BIWIN Spec PZ005 Series industrial-grade wide-temperature DDR4 memory has received two prestigious industry honors: the GGII Robotics Golden Ball Award “Innovative Product of the Year” and the OFweek 2025 IoT “Innovative Technology Product Award — Chip Technology Breakthrough Award.”
Author：BIWIN Storage Technology
GamePad Digital (GPD) is recognized as a game-changer in smart gaming, office and handheld consoles, committed to bring consumers leading-edge innovations and ultimate personalized experiences. GPD WIN 5, its latest masterpiece, breaks the limits of “handheld console productivity” and its innovative adoption of BIWIN Mini SSD brings users ultra-fast loading, free expansion, and reliable on-the-go data storage experiences.
Author：BIWIN Storage Technology
The increasing requirements of wearables such as AI glasses and smartwatches for ultimate thinness and lightness, extended battery life, and advanced multimodal AI capabilitiess are propelling the demands for storage and memory solutions that are more compact, energy-efficient, and high-performing. BIWIN ePOP5x stands as the “small but powerful” solution designed for portable intelligent terminals backed by its ultra-small size, superior efficiency and stable reliability, perfect for thin and light devices to unleash surging AI capabilities.
Author：BIWIN Storage Technology
To deliver rock-solid performance and extreme durability in mission-critical applications, BIWIN has officially released the TGQ200 Series, a flagship industrial-grade SSD family featuring PCIe Gen4 ×4 interface and NVMe 2.0 protocol support, with capacities ranging from 512 GB to 4 TB. Engineered for industrial automation, edge servers, edge AI boxes, data acquisition systems, telecom equipment, and industrial PCs, the TGQ200 integrates multiple reliability designs including -40 °C to +85 °C wide-temperature operation, over-voltage and over-current protection (OVP & OCP), data protection, S.M.A.R.T. and etc.
