Packaging type - BIWIN Storage Technology

Home
Products

Embedded Storage

eMMC

eMCP

ePOP

UFS

BGA SSD

DMMC

Memory

LPDDR

Small Capacity Storage

SPI NAND

SSD

2.5 SATA SSD

mSATA SSD

U.2 SSD

Half Slim SSD

1.8 SATA SSD

Rugged SSD

AIC PCIe SSD

Memory Product

DDR4 UDIMM

DDR4 SODIMM

Products

Embedded Memory Chips

INNOVATIVE SOLUTIONS FOR STORAGE

More Intelligent
Solutions

Application

In-vehicle

Server

Healthcare

Embedded

Special Industrial

Gaming

Surveillance

Smart Phone

Networking

Gaming

Notebook

Smart Wear

Technical Feature

Wide Temperature

Underfill

Physical Destruction

AES Encryption

Write Protect

Wear Levelling

Anti-Sulfuration

Firmware Backup

pSLC

Direct Write

Garbage Collection & TRIM

Thermal Throttling

Package Type

LAG

QFN

SIP

INNOVATIVE SOLUTIONS FOR STORAGE

More Intelligent
Support & Services

Download

Download Files

Warranty Policy

Warranty Policy

INNOVATIVE SOLUTIONS FOR STORAGE

More
About Us

Company Advantage

IC Packaging and Testing

Quality Management

Customized Service

About Us

Company Profile

News

Contact Us

INNOVATIVE SOLUTIONS FOR STORAGE

More

Stock Symbol: 688525 ｜ Search CN

×

Home > Solutions > Packaging type

BGA

LAG

QFN

SIP

TSOP