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BIWIN BGA SSD(image 1)
BIWIN BGA SSD(image 1)
BIWIN BGA SSD

BGA SSD

BIWIN eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging. Supports SATA 3.1 specification. By combining advanced NAND flash with SSD controller and flash management technology, eSSD provides higher and reliable performance. SATA is the most popular and mature interface for large-capacity storage devices. BIWIN eSSD is compliant with SATA protocol and is exclusively designed for devices that support the SATA interface.


BIWIN eSSD is characterized by its low power consumption and since it's a non-volatile memory device, it can maintain stored data without power supply. It also has a wide range of operating temperature, high shock and vibration tolerance.

Product specifications
Interface PCIe 4.0 x 2
PCIe 3.0 x 2
SATA III
Dimensions PCIe 4.0 x 2: 11.50 × 13.00 mm
PCIe 3.0 x 2: 11.50 × 13.00 mm / 12.00 × 16.00 mm
SATA III: 16.00 × 20.00 mm
Max. Sequential Read PCIe 4.0 x 2: 3500 MB/s
PCIe 3.0 x 2: 1900 MB/s
SATA III: 470 MB/s
Max. Sequential Write PCIe 4.0 x 2: 3200 MB/s
PCIe 3.0 x 2: 650 MB/s
SATA III: 350 MB/s
Frequency /
Capacity PCIe 4.0 x 2: 256 GB - 1 TB
PCIe 3.0 x 2: 128 GB - 256 GB
SATA III: 32GB - 256 GB
Working Voltage PCIe 4.0 x 2: VCC=2.5 V, VCCQ =1.2 V, VCCK=0.8 V
PCIe 3.0 x 2: VCC=3.3 V, VCCQ =1.2 V, VCCK=0.9 V
SATA III: VCC=3.3 V, VCCQ =1.8 V, VCCK=1.1 V
Working Temperature Consumer Grade: 0℃ - 70℃
Industrial Grade: -25℃ - 85℃
Approved Verification Platforms /
Packaging PCIe 4.0 x 2: FBGA345
PCIe 3.0 x 2: FBGA291 / FBGA345
SATA III: FBGA157
Application In-vehicle / Notebook
选型信息

60GB

BWS3BTCDC-60G

 

120GB

BWS3BTCDC-120G

 

240GB

BWS3BTCDC-240G