Packaging and testing

BIWIN IC Packaging Process

Wafer Thinning

Function:Wafer thinning is the process of grinding the back side of a wafer to reduce it to a suitable thickness required for packaging.

Equipment model:TSK PG3000RM

Capacity:

8-inch, 12-inch wafer processing capacity
Maximum thinning 25 um
The wafer thickness error ±5 um

Wafer Cutting

Function:Wafer cutting is the process of cutting and separating the dies on a wafer.

Equipment model:TSK AWD-300TXB & Disco DFD6361

Capacity:

12-inch wafer processing capability
The minimum cutting channel can reach 45 um

Wafer Mounting

Function:Place each die in the lead frame or substrate, and stick and fix it in Epoxy

Equipment model:Hitachi DB-830 Plus

Capacity:

Mounting accuracy ±15 u
Minimum die size: 0.5 × 0.5 mm
Capable to produce dispensing and DAF

Bonding Wire

Function:The die bonding pad is welded to the substrate bonding pad or the I/O lead in the lead frame using high purity gold, copper or alloy wire.

Equipment model:K &S Iconn

Capacity:

Gold wire with diameter of 0.6 mil can be produced
Copper wire and alloy wire can be produced massively

Plastic Package

Function:Seal the dies at the front end that completes the welding wire, to protect the die and welding wire from damage, pollution and oxidation.

Equipment model:Towa Auto Mold Y-1

Capacity:

Automatic production machine with vacuum system
Mass production machine plate size is 240 × 74 mm

Tin-ball Welding

Function:Weld the fixed-specification tin ball on the machine plate which has completed molding.

Equipment model:AurIgIn Au 800 A Soldier Ball Mounter-Cell 2

Capacity:

The minimum diameter of mounted tin ball is 0.25 mm
Minimum spacing of tin balls is 0.4 mm

Cutting Molding

Function:Separate the packaged chip from the substrate or lead frame and form a pre-designed shape.

Equipment model:HAMI semiconductor – 3000； ASM Trim Form MP209

Capacity:

The contour accuracy of the product can be controlled within ±50 um
Capable to achieve cutting of product with“ opposite” shape

Adhering to Strict Testing Standards

All BIWIN's products go through strict design verification, including performance testing, product safety testing, compatibility and stability testing, and environment and reliability test, to ensure that every product at the any stage of production (R&D, mass production to after-sales service) has excellent and stable performance and is in line with various international certification.

O/S test

Functional test

Power consumption test

AC parameter test

DC parameter test

Signal integrity test

SATA eye map test

Basic function test

Performance test

WA test

ATACT Command test NCQ, Trim and other command tests Various platforms and OS compatibility Test

RDT