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Stock Symbol: 688525 ｜
Function:Wafer thinning is the process of grinding the back side of a wafer to reduce it to a suitable thickness required for packaging.
Equipment model:TSK PG3000RM
Function:Wafer cutting is the process of cutting and separating the dies on a wafer.
Equipment model:TSK AWD-300TXB & Disco DFD6361
Function:Place each die in the lead frame or substrate, and stick and fix it in Epoxy
Equipment model:Hitachi DB-830 Plus
Function:The die bonding pad is welded to the substrate bonding pad or the I/O lead in the lead frame using high purity gold, copper or alloy wire.
Equipment model:K &S Iconn
Function:Seal the dies at the front end that completes the welding wire, to protect the die and welding wire from damage, pollution and oxidation.
Equipment model:Towa Auto Mold Y-1
Function:Weld the fixed-specification tin ball on the machine plate which has completed molding.
Equipment model:AurIgIn Au 800 A Soldier Ball Mounter-Cell 2
Function:Separate the packaged chip from the substrate or lead frame and form a pre-designed shape.
Equipment model:HAMI semiconductor – 3000； ASM Trim Form MP209
All BIWIN's products go through strict design verification, including performance testing, product safety testing, compatibility and stability testing, and environment and reliability test, to ensure that every product at the any stage of production (R&D, mass production to after-sales service) has excellent and stable performance and is in line with various international certification.
ATACT Command test NCQ, Trim and other command tests Various platforms and OS compatibility Test