Date：2022/11/17
BIWIN LPDDR5 featuring strong performance, lower power consumption, great reliability, and larger capacity, is ideal for smartphones, tablets, and automobiles.
Date：2022/11/3
BIWIN EP400 adopts novel flip-chip packaging to provide a small size die, faster data transmission, and higher signal density.
Date：2022/10/24
BIWIN provides an innovative PCIe BGA SSD+LPDDR4X storage solution for ARM servers.
Date：2022/9/26
BIWIN provides high-efficient eMCP and ePOP storage solutions to make smart terminal applications small in size and excel in performance.
Date：2022/9/15
Recently, Mr. Chen Huijun, Secretary-General of Shenzhen Automotive Electronics Industry Association, visited BIWIN, and awarded the plaque of the vice-chairman unit. Mr. Sam Sun, Chairman of BIWIN, and Mr. Cai, Deputy General Manager treated Mr. Chen cordially, and the two parties had in-depth exchanges on the development of the association, the prospects of the industry, and the trend of automotive storage.
Date：2022/9/1
BIWIN Storage Wins Top Achiever Award for a Leading Manufacturer of Consumer Storage
Embedded Chips
Industrial SSD
IC Packaging & Testing Service 
Customized Service 
