BIWIN’s DMMC solution adopts a highly integrated design by adding a low-power controller to the NAND flash, and the ECC (Error Correction Circuitry) hardware engine achieves smart management of NAND flash and improves the durability of TLC and MLC NAND flash, and the enhanced instruction support with embedded test mode gives high flexibility of customization management and fault analysis. With high reliability and stability, as well as multiple power-saving optimizations, BIWIN DMMC is well suited to the needs of a wide variety of mobile/portable devices, such as smartphones, tablets, and other emerging embedded applications.

Product specifications
Interface eMMC 5.1 & eMMC 4.51
Dimension 9.00mm × 11.00mm × 1.00mm
Max. Sequential Read
Max. Sequential Write
Density 4GB~16GB
Approved Verification Platform
Operating Voltage VCC=3.3v,VCCQ=1.8v
Operating Temperature -20℃~70℃
Packaging BGA132/BGA152/TSOP48
Application Vehicle-Mounted Multimedia Terminal / Smart Phone / Gaming