As the capacity of smart phone operating system and applications increases, especially with the increasing popularity of the Android operating system, smart phones have higher requirements of storage capacity. BIWIN's eMCP is based on MCP (Multi-Chip Packaging), which integrates an eMMC chip and a low-power DRAM solution into once IC package, effectively simplifying the manufacturing process and development cost of customers' products and shortening the development time of their products, thereby speeding up the launch of end products.
| Interface |
eMMC: eMMC 5.0 & eMMC 5.1 LPDDR 2 / LPDDR 3: 32bit |
|---|---|
| Dimensions | 11.50 × 13.00 mm |
| Max. Sequential Read |
eMMC 5.0: 130 MB/s eMMC 5.1: 300 MB/s |
| Max. Sequential Write |
eMMC 5.0: 50 MB/s eMMC 5.1: 160 MB/s |
| Frequency | LPDDR 2 / LPDDR 3: 533 MHz / 800 MHz / 1200 MHz |
| Capacity |
8 GB + 4 Gb / 8 GB + 8 Gb 16 GB + 8 Gb / 16 GB + 16 Gb |
| Working Voltage |
eMMC: VCC=3.3 V VCCQ=1.8 V LPDDR 2: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V LPDDR 3: VDD1=1.8 V, VDD2=VDDQ=VDDCA=1.2 V |
| Working Temperature | -20℃ to 85℃ |
| Approved Verification Platforms |
Spreadtrum: 7731E, 9832E, 9820E, SC9850K, SC7731C, SC7731G, SC8825, SC9820, SC9832, SC9832A, SC9832E, SC9850, SC9853, SC9863A… Qualcomm: 8909, APQ8009W, MSM8909W… MediaTek: MT6580, MT6735, MT6737, MT6739, MT6761, MT6570, MT6570N, MT6572, MT6735... |
| Packaging | FBGA162 / FBGA221 |
| Application | In-vehicle / Smart Phone |
|
32GB+32Gb |
BWCC2KD6-32G |
|
|---|---|---|
|
64GB+32Gb |
BWCC2KD6-64G |
