As a next-generation embedded memory chip, the BIWIN UFS chip is three times faster than the latest eMMC 5.1 standard. In addition, UFS 2.1's faster performance could effectively ensure the safe transmission of data without unnecessary lag caused by reading and writing operations, which is the key to the higher speed achieved in UFS 2.1. In addition to its huge advantages in transfer speed, BIWIN UFS 2.1 also has excellent power consumption characteristics.
| Interface | UFS2.1 |
|---|---|
| Dimension | 11.50×13.00×1mm |
| Max. Sequential Read | 800MB/s |
| Max. Sequential Write | 260MB/s |
| Density | 32GB~512GB |
| Approved Verification Platform | Qualcomm:835；845； |
| Operating Voltage | VCC=3.3V，VCCQ=1.8V |
| Operating Temperature | -20℃~85℃ |
| Packaging | FBGA153 |
| Application | Smart Phone / Notebook |
|
32GB |
UFB2752Q12N-32G |
|
|---|---|---|
|
64GB |
UFB2752Q12N-64G |
|
|
128GB |
UFB2752Q12N-128G |
