As a next-generation embedded memory chip, the BIWIN UFS chip is three times faster than the latest eMMC 5.1 standard. In addition, UFS 2.1's faster performance could effectively ensure the safe transmission of data without unnecessary lag caused by reading and writing operations, which is the key to the higher speed achieved in UFS 2.1. In addition to its huge advantages in transfer speed, BIWIN UFS 2.1 also has excellent power consumption characteristics.
| Interface | UFS 2.1 / UFS 2.1 / UFS 3.1 |
|---|---|
| Dimensions | 11.50 × 13.00 mm |
| Max. Sequential Read |
UFS 2.1: 500 MB/s UFS 2.1: 500 MB/s UFS 3.1: 1200 MB/s |
| Max. Sequential Write |
UFS 2.1: 856 MB/s UFS 2.1: 856 MB/s UFS 3.1: 300 MB/s |
| Frequency | / |
| Capacity |
UFS 2.1: 128 GB - 256 GB UFS 2.1: 128 GB - 256 GB UFS 3.1: 128GB - 512GB |
| Working Voltage |
UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V |
| Working Temperature | -20℃ - 85℃ |
| Approved Verification Platforms |
UFS 2.1: Qualcomm: 835, 845... UFS 2.1: Qualcomm: 835, 845… UFS 3.1: Qualcomm, MediaTek... |
| Packaging | FBGA153 |
| Application | Notebook / Smart Phone |
|
32GB |
UFB2752Q12N-32G |
|
|---|---|---|
|
64GB |
UFB2752Q12N-64G |
|
|
128GB |
UFB2752Q12N-128G |
