BIWIN provides an innovative PCIe BGA SSD+LPDDR4X storage solution for ARM^TM servers which solves the storage protocol limitations of the SOC platform and improves experience with mobile applications.

With up to 1TB capacity, the BIWIN EP400 PCIe BGA SSD comes with the high-speed PCIe 4.0 x 2 to deliver up to 3500 MB/s read and 3300 MB/s write-- with dimensions of just 11.5 mm (L) x 13 (W) mm. Coupled with LPDDR4X, this BIWIN EP400 runs at speeds up to 4266 Mbps with a capacity up to 64 Gb.

Additionally, BIWIN launched the EP310 series with the PCIe 3.0 x 2 interface and NVMe 1.3. With a dimension of only 16 mm (L) x 20 (W) mm, EP310 delivers maximum read and write speeds up to 1600 MB/s and 1300 MB/s respectively. It also works with the Rockchip high-end RK3588 SoC.

With the advantage of its decades of experience in its own chip packaging and testing facilities, BIWIN is able to provide innovative storage solutions known for great performance, large capacities, smaller size, lower power consumption and lower Total Cost of Ownership (TCO)—all of which contribute to a better experience with mobile applications.

One known benefit of the ARM^TM architecture is the power-efficiency that allows mobile devices to be always on and always connected. ARM is at the epicenter of the world’s largest compute ecosystem. With more than 1000 partners (hardware, software, tooling, and service providers), the ARM^TM architecture delivers exceptional and efficient experiences to millions of users across multiple industries and devices.

With the anticipated sales growth in 2023 (and beyond) for ARM^TM in servers, PCs and mobile devices, BIWIN anticipates a great reception to its lines of BGA SSD solutions built to improve performance with ARM^TM servers and ARM-embedded devices including gaming smartphones, ultrathin laptops, automotive, and other smart industrial equipment.