BIWIN Won Top Influential Brand Awards and Distinguished Service Awards in Packaging and Testing
The 2022 Global Memory Innovation Forum (hereinafter referred to as GMIF 2022) was co-organized by Shenzhen Municipal People's Government, China Semiconductor Industry Association, Shenzhen Semiconductor Industry Association, and the National Science and Technology Special Project Expert Group of "Core electronic devices, high-end general-purpose chips, and basic software products". BIWIN was invited to attend this forum and won the Top Influential Brand Awards and Distinguished Service Awards in Packaging and Testing.
Under the theme of "Seeking Win-Win Results in Innovation through Demands", GMIF 2022 brings memory manufacturers both at home and abroad together to share their insights into innovation, development, and ecosystem in global memory market. Mr. Sam Sun, Chairman of BIWIN Storage Technology Company Limited, was invited to deliver a speech, with a topic focusing on BIWIN: From Chips to Clients, Exploring a Win-Win Route with Our Business Partners. This forum offers an opportunity to meet executives from industry-leading companies, including Intel and Amazon Cloud, to discuss the present and the future of the industry.
As an essential pillar of the semiconductor industry and the foundation of the electronic information industry, the memory industry has a long industrial chain. The forum brings together upstream and downstream manufacturers to reach the goal of building a win-win memory industry ecosystem. Mr. Sun introduced BIWIN’s business pattern, product system, competitive advantages and market position in details, including its advantages in bulk supply, product consistency guarantee and customized service. BIWIN is a pioneer entering the supply chain system of world-leading enterprises, with a high market share. BIWIN memory chips for smart terminals boast small size, high performance, and low power consumption, entering the supply chain of world-class enterprises. BIWIN adopts advanced packaging technologies including multi-layer Die stacking, ultra-thin Die, and multi-chip hetero structure integration to realize high yield rate, growing into a industry-leading player.
In the Storage Industry Ecosystem Forum, Mr. Cai Dong, Deputy General Manager of BIWIN, was invited to attend the round-table discussion, exchanging ideas with executives of Foxconn and other well-known enterprises over the opportunities and challenges facing domestic memory industry. Mr. Cai pointed out that BIWIN will continue to enhance its R&D capacity, deepen the layout of the industry chain, give full play of its advantage to empower customers and the market. And BIWIN will put more efforts into business expansion in North America, South America, India and Europe.
