On November 7, the 2024 China Microelectronics Industry Conference & the 19th “China Chip” Award Ceremony was held in the Hengqin Guangdong-Macao In-depth Cooperation Zone. Supported by accumulated core edges in research and development of self-owned storage solutions and packaging and testing, BIWIN has achieved breakthroughs in innovative R&D design of ePOP products, which features “Ultra-compact Size, Ultra-low Power and High Performance”, and was honored as the China Chip “Excellent Supporting Service Enterprise.”
The “China Chip” Excellent Product Selection is one of the most influential and authoritative events in China’s integrated circuit industry, aiming to showcase the latest products and technological achievements in the IC sector. The “Excellent Supporting Service Enterprise” award focuses on four main areas: core IC materials, wide-bandgap semiconductor materials, IP, and packaging and testing, dedicated to acknowledging enterprises with technical expertise, innovation capabilities, independent intellectual properties, excellent customer service, and promising application prospects.
The ePOP product that BIWIN entered for the award was specifically designed for the smart wearable market. Tailored for high demands of smartwatches and similar devices for miniaturization, ultra-thinness, and low power consumption of storage chip, BIWIN embraces frontier packaging processes including multi-layer die stacking, ultra-thin die, and multi-chip heterogeneous integration. As a result, this version of ePOP achieves a compact size of 8.6mm × 10.4mm with a thickness of just 0.65mm. Moreover, it demonstrates effectiveness in addressing challenges associated with warpage of ultra-thin chips at high temperatures, contributing to ensuring high reliability during prolonged operation. The product has been granted multiple technical invention patents, including “Chip Warpage Optimization Method and Device, Readable Storage Medium and Electronic Equipment.”
Integrating eMMC5.1 and LPDDR4X, this ePOP product offers capacities of 32GB+2GB and saves 78% of mainboard space compared to separate solutions. Through vertical mounting on the SoC chip, it enables sleek and slim smartwatch designs. Thanks to its self-developed firmware algorithms, advanced low-power design, and optimized power management, the product achieves a perfect balance of size, performance, and power consumption. With a read speed of up to 300MB/s and a frequency of up to 4266Mbps, the power consumption is maintained within 500mW. At present, BIWIN’s ePOP series products are widely used in high-end wearable devices, such as smartwatches and VR glasses, by well-known companies like Google, Meta, and IMOO.
This honor of being named China Chip “Excellent Supporting Service Enterprise” is more than a high recognition of BIWIN’s excellence in storage solutions and advanced packaging and testing services; it’s also a strong testament to the company’s continuous innovation capabilities and industry leadership. Moving forward, BIWIN will take it as a stepping stone to give a full play of its core advantages in storage solution development and advanced packaging and testing. The company will continue to launch more storage products featuring high performance, high reliability, low power consumption, and ultra-compact sizes to meet the diversified needs of the market. Through joint efforts with customers and industry partners, BIWIN is committed to boosting the flourishing development of China’s semiconductor industry and empowering a win-win outcome in technological innovation and commercial value.