On November 7, the "One Wear, One World" – 2024 UNISOC Smart Wearable Salon was successfully held in Shenzhen. As a key ecosystem partner of UNISOC, BIWIN was invited to participate and showcased its full range of smart wearable storage solutions, including eMMC, eMCP, ePOP, and LPDDR4X/5/5X. These solutions are now widely used in wearable devices such as smartwatches, smart glasses, fitness trackers, and AR/VR headsets.
Smart wearable products have greatly enhanced user experience through integrated functions such as heart rate monitoring, sleep analysis, smart navigation, immersive virtual reality experiences, and personalized customization. As a crucial component of smart wearable devices, storage plays a core role in ensuring device functionality and data security. Drawing on its deep expertise in storage media characteristics research, self-developed firmware algorithms, multi-chip heterogeneous integration packaging technology, and self-developed chip testing systems and algorithms, combined with a profound understanding of market demands, BIWIN has launched a series of smart wearable storage products featuring high performance, low power consumption, small form factor, high reliability, and high durability. This wide product spectrum is able to flexibly satiate the requirements of different devices and application scenarios while supporting customers' differentiated needs.
BIWIN's eMMC achieves sequential read and write speeds of up to 320MB/s and 270MB/s respectively, with capacity reaching 512GB. It's worth noting that the company launched an ultra-small eMMC approaching packaging limits in 2019, measuring only 7.5×8.0×0.7 (mm), which has been a highly acclaimed storage solution for the smart wearable market. The eMMC also features HS400 mode, FFU functionality, full-disk scanning, built-in LDPC ECC for automatic error correction, and automatic sleep mode for lower power consumption, helping to improve data transfer speed and reliability while extending device battery life.
BIWIN's eMCP4x and ePOP4x, based on packaging technologies such as multi-layer die stacking, ultra-thin die, and multi-chip heterogeneous integration, are integrated with eMMC5.1 and LPDDR4x, achieving data transfer rates of up to 4266Mbps. The two series also come equipped with advanced low-power design and optimized power management to guarantee quick response to various sensor data requests and maintain smooth operation during multitasking at the meantime. The ePOP4x reaches capacities of 32GB+2GB (with 64G+2/3/4GB coming soon to enable AI applications in AR, VR devices), measures as small as 8×9.5×0.7 (mm), and can be directly mounted on the SoC chip to facilitate slim smartwatch designs. Currently, the ePOP series products have already been widely applied in high-end wearable devices by globally renowned enterprises and have won awards including "World Electronics Achievement Award for Memory of the Year", "Best Memory Chip", and "'China Chip' Key Infrastructure Support Product".
Besides, BIWIN also offers UFS3.1, uMCP4x/5, LPDDR4X/5/5X series products. Thereinto, its New-Gen LPDDR5X, manufactured by using 1bnm process, achieves a 33% increase in data transfer rate to 8533Mbps with 25% lower power consumption compared to the previous generation, demonstrating excellence in ensuring efficient device operation and long battery life while enabling smooth operation of high-end smart phones and other terminal devices. At present, BIWIN's LPDDR series products have been included in the supply systems of several top consumer electronics companies.
Conclusion
Taken as a leading storage solution provider in China, BIWIN has won widespread recognition from end customers in the smart wearable field through its long-term accumulation of storage miniaturization and integration technologies. As smart wearable devices gradually expand toward edge applications such as augmented reality (AR) and virtual reality (VR), the demand for efficient integration of storage and computing becomes increasingly urgent. The profound experience in these technical areas grants BIWIN a first-mover advantage in expanding into edge artificial intelligence (AI) and AR applications. In the future, BIWIN will uphold its entrepreneurial spirit of "Win-Win (Bi-Win)", further cooperation with industry chain partners, and make the most of its expertise in storage solutions, advanced packaging technology, and supply chain optimization management to meet diverse customer needs, actively explore intelligent storage solutions in emerging application areas such as edge AI and AR, and help customers enhance product competitiveness.