The 2024 Capital Power Annual Brand Awards, hosted by Stock Star, recently revealed its winners. BIWIN Storage Technology Co., Ltd. (Stock Code: 688525) was awarded both the “Outstanding Listed Company Award” and “Secretary Excellence Award.”
Outstanding Listed Company Award
BIWIN dedicates itself to the research, development, packaging, testing, production, and sales of semiconductor storage and memory devices. The company successfully listed on the STAR Market in December 2022 and has been included in the “STAR 50” index. Recognized as a leading enterprise in China’s storage solutions sector, BIWIN has built and continuously deepened its integrated R&D and packaging/testing business model to develop a comprehensive product portfolio covering embedded storage, PC storage, industrial/automotive-grade storage, enterprise storage, and mobile storage solutions. The company has accumulated deep market presence and supply chain resources to comprehensively strengthen its product capability, channel strength, and brand power, demonstrating strong development resilience and hard technology capabilities.
In 2024, BIWIN rode the wave of industry growth to actively expand its customer base both domestically and internationally. This resulted in a significant increase in product sales and revenue, marking a dual success in both market expansion and performance growth. In the first three quarters of 2024, the company’s operating income reached 5.025 billion yuan, a year-on-year increase of 136%. After excluding stock-based compensation expenses, the net profit attributable to the parent company was 525 million yuan, a year-on-year increase of 200%.
Committed to the principle of driving high-quality development through technological innovation, BIWIN is making strives to continuously increase R&D investment in areas including solution development, chip design, advanced packaging/testing, and testing equipment, among others. In the first three quarters of 2024, the company’s R&D investment reached 340 million yuan, achieving a year-on-year increase of 123.6%. At present, BIWIN’s independently developed domestic controller chips have passed preliminary selection by leading manufacturers and received widespread recognition. This has contributed to promoting the company’s market expansion in QLC mobile storage, smart wearables, and industrial/automotive sectors. Meanwhile, the company’s advanced packaging process has progressed from primarily 16-layer die stacking to 32-layer die stacking, which has now been translated into boosted memory packaging and testing capacity. Besides, its wafer-level advanced packaging and testing manufacturing factory, located in Songshan Lake, Dongguan, is under steady construction, aimed at developing high-end packaging and testing technologies such as 2.5D/3D, and further creating a benchmark of packaging and testing industry in the Greater Bay Area.
Secretary Excellence Award
The awarding of the “Secretary Excellence Award” to Yanfeng Huang, Secretary of the Board from BIWIN, is considered as a resounding affirmation of the company’s proactive and rigorous approach to serving shareholders and the wider investment community. Underpinned by an efficient and transparent communication mechanism, particularly methods of performance briefings, on-site research visits, investor calls, and interactive platforms, BIWIN has realized a leap concerning the enhancement of the quality of information disclosure and its corporate image across the capital market, strengthening investors’ understanding, comprehension, and recognition of BIWIN.
The company has received in-depth coverage from mainstream financial media and maintained good communication with regulatory authorities to uphold a positive image in the capital market, thereby empowering the enhancement of the company’s value. On June 14, 2024, the company officially became a constituent of the “STAR 50” index and won the “2024 Most Valuable Sci-Tech Innovation Board Listed Company” award at the “the Fifth Anniversary of the Opening of the Sci-tech Innovation Board Summit,” demonstrating the company’s leadership in technological innovation and market recognition of its value.