Recently, the 12th China Technology Market Association Golden Bridge Award was announced, and Chengsi Sun of BIWIN Chairman was honored with the second prize. The China Technology Market Association Golden Bridge Award, approved by the National Office for Science and Technology Awards, aims to commend individuals and organizations that have made remarkable contributions to technological achievement transformation and innovation. This award is a proof that highlights BIWIN’s core value and industry influence in driving technological achievement industrialization and leading innovation in the storage industry.
Dual Engines of “Storage + Packaging & Testing”, Fortifying a Solid Technical Moat
Established its roots in storage and memory solutions and packaging and testing manufacturing, BIWIN has drawn on its profound technological accumulation and innovative prowess to unfold exceptional capabilities in the convergence of storage and computing. Since its inception in 2010, BIWIN has taken a forward-thinking approach to establish independent packaging, testing, and memory R&D capabilities. This has not only bolstered its self-reliance in technology and production but also allowed BIWIN to achieve deep synergy with extensive partners across the industrial value chain, promoting overall industry innovation and exploring a “Win-Win” collaborative development model.
Building on this foundation, BIWIN continues to uphold the development philosophy of “building success through technology” to accelerate product innovation and nurture high-quality service capabilities. Under the leadership of Chairman Chengsi Sun in recent years, its “Integrated R&D and Packaging 2.0” strategy has been further consolidated, and with penetrating efforts in integrating R&D, design, and packaging and testing capabilities, BIWIN has fortified a solid foundation of technical moat and grown into a salient provider of efficient and value-added storage solutions, enabling greater business value and success for customers.
Focusing on Industry Frontiers, Empowering Diverse Scenarios
Aligned with the “Integrated R&D and Packaging 2.0” strategy, BIWIN continuously breaks through key areas such as storage solution R&D, controller design, and advanced packaging and testing technologies. Its independently developed domestic QLC flash memory controller provides robust support for high-density storage applications. The 32-layer stacked Die packaging process has been mass-produced, while the R&D of 2.5D/3D wafer-level packaging and testing technologies are advanced in a steady manner, laying a technological foundation for high-bandwidth, low-power storage requirements.
By transitioning from traditional product sales to a supplier of “controller + solution + advanced packaging and testing” comprehensive services, BIWIN leverages its flexible R&D system and rapid response capabilities to seize technological high grounds in frontier trends such as edge AI and converged storage, providing broader customized storage services for upstream and downstream enterprises across the industry chain. Meanwhile, BIWIN channels these joint efforts to facilitate innovative development across multiple application domains, including intelligent wearables, mobile phones, PCs, intelligent vehicles, industrial segmented scenarios, servers/data centers, edge computing, and the Internet of Things, driving comprehensive industrial ecosystem upgrades.
Shaping the Future with Technology, Leading Industry Development
The award bestowed upon Chairman Chengsi Sun is a testament to his remarkable contributions to the commercialization of technological advancements and a powerful acknowledgment of BIWIN’s dedication to a technology-driven growth philosophy as well. In the coming years, BIWIN will uphold its “Integrated R&D and Packaging” strategy, foster growth through continuous innovation, empower customers to enhance their value, deliver “Chinese Solutions” to the global storage ecosystem, and collaborate with partners to create a thriving, mutually rewarding “Win-Win” ecosystem.