On December 14, 2024, the "2025 Semiconductor Investment Annual Meeting and IC Industry Award Ceremony," hosted by the China Semiconductor Investment Alliance and organized by JW Insights, was successfully held at Shanghai Tower. BIWIN TAE308/318 automotive-grade eMMC received the "Automotive IC Innovative Product of the Year Award", a strong proof of the company's technological prowess and product innovation capabilities in the automotive electronics sector.
01 Reliability and Security Take Precedence in the Future of Intelligent Driving
Automotive chip, functioned as the critical component of automotive electronic systems, raises particularly stringent requirements for product characteristics such as environmental adaptability, reliability, and security as its application scenarios are much more specialized compared to the consumer and industrial-grade chips. The general industry standard exemplifies that automotive chips are elementally required to support vehicle lifetime of up to 15 years or 200,000 kilometers, and at the same time, vehicles must not experience any shutdowns under high temperatures exceeding 100℃ or extreme low temperatures of -40℃. Therefore, the design and manufacturing standards for automotive-grade chips are extremely high.
BIWIN TAE series eMMC is consistent with the eMMC 5.1 standard that backs up automotive performance by integrating advanced MLC/3D TLC NAND flash, conforming to the automotive certification of AEC-Q100 Grade 2, and supporting stable operation within a temperature range of -40℃ to 105℃, aiming to offer stable and reliable storage capabilities. The series products are also equipped with features like HS400 high-speed mode, FFU (Firmware Update Over-the-Air), and idle data acceleration to further enhance system rapid response and efficient operation capabilities, as well as more functionalities including anti-shock and moisture-proof to provide a robust storage foundation for various critical scenarios including smart cockpits, in-vehicle infotainment systems (IVI), central consoles, navigation systems, autonomous driving platforms, instrument panels, T-Box, and domain controllers. In addition, BIWIN's TAE series eMMC incorporates a series of advanced technologies, including full-cycle bad block management, power loss protection, global wear leveling management, powerful ECC algorithms, boot partition and RPMB technology, aimed at ensuring data security and integrity while establishing safeguards for end-user driving experience and privacy.
02 Stable and Continuous Supply with Rigorous Quality Control Capabilities
Considering the importance of supply chain stability to the automotive industry, BIWIN, with its integrated R&D and packaging capabilities and strong supply chain resources, has established high-standard quality control and process capabilities for automotive-grade products. The company guarantees continuous supply of the TAE series eMMC for over five years and meets the high-quality requirement of <5 PPM.
BIWIN has been certified with IATF16949 automotive quality management system, and its automotive product portfolio has passed authoritative AEC-Q100 reliability certification. Furthermore, with the support of self-developed automotive-grade product testing and verification platforms and automated testing systems, a comprehensive and stringent automotive-grade product testing system has been established to meet full chain coverage from system layer, application layer, protocol layer, to electrical layer for products including eMMC, UFS, and LPDDR.
Meanwhile, BIWIN has tailored a complete coverage of testing cases for automotive-grade products from research and development to mass production across the full lifecycle and all application scenarios, including key testing stages such as performance testing, power consumption testing, protocol testing, lifetime testing, abnormal power-off, automotive platform compatibility, high and low temperature reliability testing, high-speed ATE testing, burn-in testing, and SLT (system level) testing, so as to provide stable and reliable performance even in extreme environments and long-term usage scenarios and fully meet automotive application requirements. This professional and rigorous verification system reflects our deep accumulation in automotive-grade storage technology and firm commitment to product quality.
Peng Peng, General Manager of Industrial and Automotive BU at BIWIN, stated, "Currently, automotive electronics are undergoing a profound transformation from electrification to intelligence and connectivity. As the demand and value of automotive storage chips are jumping to a higher level, the performance of storage chips, namely reliability, security, and efficiency, are becoming key factors determining the development levels of automotive intelligence. BIWIN Spec automotive-grade eMMC, with its excellent performance, reliable quality, and exceptional data security, has been validated in mass-produced vehicle models of several renowned OEMs, providing strong support for accelerating intelligent driving technology iteration. In the future, BIWIN will continue to closely follow the changing needs of different automotive scenarios, creating diversified automotive-grade product combinations and solutions through technological innovation. Meanwhile, we look forward to working closely with industry chain partners to jointly help the intelligent automobile industry reach new heights."
03 Diverse Automotive Storage Matrix Supporting Intelligent Upgrades
Apart from the award-winning automotive-grade eMMC, BIWIN automotive-grade storage products also include a wider range of form factors consisting of LPDDR, UFS, BGA SSD, and Card, cementing a strong foundation of security and reliability on the basis of offering excellent data read and write performance, in order to forge storage capabilities for advanced application scenarios such as L4/L5 intelligent driving. On the technological layout front, BIWIN has developed comprehensive competence in storage media research, IC design, self-developed firmware, and advanced packaging and testing; meantime, much efforts have been invested to further its industry layout to provide customers with solutions featuring higher reliability and superior performance, supporting the development of the intelligent automotive industry.