BIWIN made a significant impact at the 58th International Consumer Electronics Show (CES 2025) in Las Vegas, showcasing breakthrough innovations including the brand-new generation Mini SSD and X570 PRO PCIe 5.0 flagship SSD, along with its full series solutions for embedded, PC, mobile, industrial/automotive, and enterprise applications, supporting AI demands across various terminal devices. It’s worth noting that BIWIN self-owned consumer brand—DW100 RGB DDR5 memory—clinched the CES 2025 Innovation Award for its outstanding performance and unique design.

01 High-End Gen5 SSD and High Frequency DDR5 Enabling High-Speed AI PC Experience

Higher requirements are raised for storage and memory as AI PCs demand increased computing power. BIWIN’s self-owned consumer brand launched several of innovative products of PCIe 5.0 high-speed SSDs and DDR5 ultra-high frequency memory, empowering an enhanced PC edge AI experience.

DW100 RGB DDR5 Wins CES 2025 Innovation Award

At CES 2025, BIWIN DW100 RGB DDR5 memory stood out with its exceptional performance and unique design, reckoned with CES Innovation Award, as well as the 2024 German Red Dot Award and French Design Gold Award. BIWIN DW100, combined with lower memory timings, delivers up to 8400 MT/s, bringing you top-tier performance for gaming, AI computing, creative work, and productivity tasks.

X570 PRO PCIe 5.0 Flagship SSD: Global Debut at CES 2025

In addition, BIWIN’s X570 PRO Tianqi PCIe 5.0 SSD made its global debut at the exhibition, representing a significant advancement in storage technology. This innovation features PCIe 5.0×4 interfaces and NVMe 2.0 protocol, offering read speeds up to 14000MB/s. With dedicated DRAM cache chip design combined with SLC cache technology, it delivers 4K random read/write speeds up to 2000K IOPS and 1600K IOPS respectively. The groundbreaking speed boost greatly enhances game loading and data transfer efficiency, bringing transformative experiences for AAA titles, productivity, and AI creation.

02 New-Gen Mini SSD, Rather Compact for Edge Intelligence Era

At CES, BIWIN also shined with its new-gen Mini SSD, a breakout product with LGA advanced packaging that highly integrates controller and NAND flash, realizing a revolutionizing form factor measuring only 15mm×17mm×1.4mm (comparable to half the size of a coin). Adopting PCIe 4.0×2 interfaces and NVMe 1.4 protocol, the Mini SSD is able to achieve impressive read speeds up to 3700 MB/s and write speeds up to 3400 MB/s. With capacities ranging from 512 GB to 2 TB, this solution meets the rigorous demands of mobile devices, edge computing, and other data-intensive applications.

03 ePOP4x: High Integration and Speeds for Smart Wearables

Smart glasses have fast become the AI hardware of choice, with CES highlighting their meteoric rise in popularity. In the meantime, smart health is stealing the show in consumer electronics, as health monitoring becomes an embedded aspect of daily living. AI-enabled devices like rings, smartwatches, chairs, and even beds are at the forefront, offering a more fluid and effortless interaction method.

Tailored for the blooming smart wearables market, BIWIN has unveiled cutting-edge storage solutions for AI glasses, smartwatches, and AR/VR/MR headsets. A prime example is the ePOP4x, which integrates eMMC and LPDDR4X into a compact form factor, making it ideal for wearables. With data transfer speeds reaching up to 4266Mbps, it offers excellent performance in a small package. Available in a range of capacities (32/64GB + 2/3/4GB), the ePOP4x also features low-power design optimization, ensuring efficient operation and extended battery life. This product is already in use across leading wearable devices from brands like Google, Meta, Xiaomi, IMOO, and Sharge Technology.

At CES, BIWIN also unveiled a range of diversified, highly reliable storage solutions, including options for smartphones, mobile devices, industrial/automotive-grade applications, and enterprise storage. These solutions are designed to meet the diverse needs of various sectors, from smartphones and autonomous driving to data centers and AI servers.

CES 2025 sent a clear message: AI will become deeply integrated across industries, emerging as a dominant trend in the coming year. In response, BIWIN will accelerate its “Integrated R&D and Packaging 2.0” strategy, tapping into its expertise in IC design, storage media research, firmware development, advanced packaging and testing, and test equipment innovation. By continuously improving product performance, reliability, and other key features, BIWIN aims to deliver cutting-edge solutions that meet the dynamic needs of the market, ensuring end devices provide efficient, stable performance across a wide range of AI applications.