Nuremberg, Germany, March 11-13, 2025—At Embedded World 2025, BIWIN rolled out an impressive lineup of its state-of-the-art storage solutions, spanning embedded, industrial-grade, PC, and enterprise-grade sectors. The star of the show was the BIWIN ePOP4x storage chip, which clinched the “Best-in-Show” award from Embedded Computing Design. It stole the spotlight of the show with its ultra-compact form factor, fast responses, and low power consumption—all packed into one sleek package.

Underpinned by advanced packaging processes such as multi-layer die stacking, ultra-thin die and multi-chip heterogeneous integration, BIWIN’s ePOP4x chips successfully shrink the product form factor to as compact as 8.0mm × 9.5mm with a super-slim 0.65mm thickness, while still offering a flexible capacity options of 32/64GB + 2/3/4GB. Beyond that, the ePOP4x chips are powered by proprietary firmware algorithms, cutting-edge low-power design, and optimized power management, contributing to exceptional energy efficiency while supporting read speeds of 300MB/s and high frequency operations at 4266Mbps. These capabilities make it a strong choice for high-performance devices, offering reliable storage support, improved battery life, and a consistently smooth user experience. To date, the series products have already been successfully integrated into the supply chains of smart wearable products for several renowned domestic and international manufacturers.