In recent days, BIWIN has made a prominent mark at Auto Shanghai 2025, showcasing its fully self-developed, domestically produced automotive-grade eMMC, which combines leading performance and robust security features, complemented by a comprehensive portfolio of automotive solutions tailored for the full spectrum of intelligent connected vehicle applications. With its full-stack technical capabilities—ranging from self-developed controllers and firmware algorithms to in-house packaging and testing—BIWIN is enabling automakers to advance toward greater intelligence and connectivity.
Fully Self-Developed Automotive-Grade eMMC
A Domestic Powerhouse with Top-Tier Performance and Unwavering Safety
BIWIN Spec debuted its fully domestic and self-developed automotive eMMC. Powered by BIWIN-developed SP1800 controller which is manufactured with domestic high-quality wafer, and paired with reliable ultra-high quality design, manufacturing and efficient delivery capabilities, this innovation stands as a complete Chinese automotive solution for the automotive industry, providing a secure, dependable, and performance-advanced storage solution.
(BIWIN's Fully Self-Developed Domestic Automotive-Grade eMMC)
Built on eMMC 5.1 standard, this product offers automotive-grade performance with more technical properties such as HS400 mode, boot partition and RPMB. In addition, engineered with a maximum capacity of up to 128GB, certified with AEC-Q100 Grade2 reliability and supporting wide-temperature operations from -40℃ to 105℃, the eMMC is supported to readily endure driving shocks and vibrations, high temperatures in the engine compartment and extreme outdoor conditions. Powered by BIWIN's self-developed controller with an advanced architecture, it features enhanced parallel data processing capabilities. Combined with 4K LDPC algorithms and SRAM ECC technologies, the product offers industry-leading performance on the basis of guaranteed data security and reliability, perfect for demanding applications such as autonomous driving, intelligent cockpits, IVI systems, central control, navigation, instruments, T-Box, and domain controllers.
Comprehensive Automotive-Grade Product Portfolio
Validated by Leading Customers
BIWIN also showcased its full range of automotive-grade storage products, including eMMC, UFS, BGA SSD, LPDDR, and SD Card/microSD Card, addressing the needs of scenarios from intelligent cockpits to autonomous driving. The full lineup has been certified with AEC-Q100, and is designed to support reliable operations in extreme environments from -40°C to 105°C. In terms of market performance, BIWIN’s automotive-grade storage chips have secured a leading position in domestic shipments and have been successfully adopted by top-tier domestic automakers.
(BIWIN Spec Automotive-Grade Storage Product Portfolio)
Grounded on the profound insights into the differentiated demands for storage solutions in automotive electronic systems, BIWIN has customized the most optimal solutions for each critical scenario. For autonomous driving systems that require real-time decision-making and high-definition mapping, BIWIN’s automotive-grade embedded storage chips deliver industry-leading performance through advanced technologies, among which the eMMC-equipped top-tier ECC algorithm ensures millisecond-level responses and exceptional data reliability. For intelligent cockpit systems, BIWIN has leveraged specially-developed firmware algorithms to improve products’ bandwidth and read/write speeds. Coupled with E2E data encryption technologies, the products can also offer smoothly-fast interactive experience and all-around privacy protection.
In Internet of Vehicle systems, BIWIN’s automotive-grade products, designed for up to 30,000 P/E cycles, easily handle high-frequency read/write demands in scenarios like OTA software updates and massive sensor data transmission. Specific for IVI systems with multitasking requirements, BIWIN has scaled up efforts to optimize data parallel processing architectures, ensuring smooth multitasking across navigation, music, voice assistants, and more. As for in-vehicle surveillance and dashcam systems, BIWIN’s innovative 24/7 cyclic write optimization technology supports uninterrupted recording, ensuring zero loss of critical data.
Integrated Solution and Manufacturing (ISM)
Rapid Market Response and Flexible Solution Development
By leveraging its unique edges of ISM (Integrated Solution and Manufacturing) strategy, BIWIN has established a formidable technological barrier in the automotive storage sector. With a forward-thinking full-process layout encompassing “demand analysis, R&D design, test and verification, and mass production delivery”, BIWIN has invested specialized resources to develop a responsive market ecosystem with industry-leading R&D and quality control capabilities.
(Application Showcase Area)
In storage solution research and development, BIWIN has assembled a dedicated automotive R&D team which has channeled years of technological accumulation to upgrade storage chips in all aspects of performance, reliability and power consumption, tailored to meet automotive application scenarios. In the area of advanced packaging and testing and intelligent manufacturing, the company has built a self-owned manufacturing base specializing in storage chip packaging and testing, and certified with IATF16949 automotive quality management system, BIWIN has established a comprehensive and rigorous testing system covering the complete product lifecycle and all application scenarios, ensuring stable and reliable performance under extreme environmental conditions and long-term usage.
Regarding supply chain stability, BIWIN is embracing a diversified supply strategy to expand its advantages in integrating upstream powerful wafer resources. With continuous progress in packaging and manufacturing capabilities, especially in ultra-thin die process, BIWIN is capable to provide automotive customers with more stably-supplied and superior storage products. Through strong partnerships with automotive clients, BIWIN also develops personalized storage solutions that guarantee both technological innovation and quick market responses, effectively meeting the diverse requirements of customers.
Going forward, BIWIN Spec will continue to optimize its layout in automotive R&D and supply chain. By breaking technological bottlenecks in storage through self-owned innovations, and joining forces with upstream and downstream players in the automotive industry chain, BIWIN dedicates itself to providing secure and reliable storage solutions to support the global development of the intelligent automotive industry.