Recently, Shenzhen BIWIN Storage Technology Co., Ltd. (Stock Symbol: 688525) was honored with the title of “Shenzhen Single-Product Champion Enterprise in Manufacturing” for its outstanding performance in the field of smartphone storage chips. This recognition marks an authoritative endorsement of the company’s innovation capability, technological strength, and market leadership.

Deeply rooted in the semiconductor storage field, BIWIN has established core competitiveness in all aspects of “controller design, storage solution R&D, and advanced packaging and testing”. Backed by years of technological accumulation and market exploitation, the company has now accumulated conspicuously differentiated edges in smartphone storage sector, with wide-reaching brand influence and market recognition.

On the R&D front, BIWIN in-house eMMC controller demonstrates excellence in performance. Combined with its accumulated expertise in firmware algorithm development and ultra-thin Die packaging, as well as proprietary testing algorithms and equipment, the products are qualified for smartphones’ strict needs for high performance computing, low power consumption, compact form factor and high reliability of storage chips. The integrated technological system spanning the full chain of design, development, and manufacturing provides a solid foundation for building a leading product portfolio.

In terms of product layout, BIWIN offers a complete range of embedded storage solutions, including eMMC, UFS, LPDDR, uMCP, eMCP, and ePOP. In response to the demands of AI-powered smartphones, the company has launched advanced solutions such as UFS 3.1, LPDDR5/5X, and uMCP. Notably, its high-capacity 12GB and 16GB LPDDR5X products have entered mass production, effectively supporting edge-side large model computing with expanded storage and rapid response capabilities—providing essential hardware support for AI smartphone upgrades.

In 2024, BIWIN achieved a historic breakthrough with top-tier smartphone clients, marking a milestone in both market penetration and business growth. Looking ahead to 2025, the company will continue to align its storage solutions with progress in controller development, focusing on the fast-growing domestic AI smartphone market. BIWIN aims to accelerate the deployment of UFS 3.1, LPDDR5X, and related products in edge-side AI computing, deepen technical collaboration with leading manufacturers, and support customers in launching innovative products to gain first-mover advantage.