The 2025 Mobile World Congress (MWC Shanghai) recently concluded successfully at the Shanghai New International Expo Centre. BIWIN has made a strong mark at the event by displaying its frontier storage solutions and full-scenario application cases, highlighting its technical strengths and industry influence in storage ecosystem within the intelligent era.

Data Communication Storage Solutions

Powering Intelligent Connectivity in the 5G-A Era

In the 5G-A era, the high-speed processing and reliable transmission of massive data volumes rely on robust infrastructure. The cornerstones, specifically the 5G base stations which are responsible for handling network traffic and the communication modules that connect massive terminals such as IoT, wearables and IoV, are building up the foundation for intelligent connectivity. High-performance, reliable storage solutions are critical to ensuring the stability of the entire data chain.

BIWIN offers a full range of storage products for various scenarios covering core, edge and terminal applications, capable of addressing diverse needs from network communication systems, indoor transmission, and data processing to distributed terminals, node devices, and communication modules.

For 5G base stations (AAU, BBU), routers, switches, and gateways, BIWIN provides industrial-grade SSDs (-40°C to 85°C) and embedded chips (-40°C to 105°C) as a one-stop storage solution. Leveraging proprietary flash optimization algorithms, the products achieve up to 65,000 P/E cycles, significantly extending device lifespan. Featured with firmware/hardware-level power-loss protection and enhanced ECC, the series can ensure data integrity and transmission stability under harsh conditions such as sudden power failures or physical shocks. This comprehensive approach meets the high-reliability storage demands of embedded data storage, real-time high-speed data processing, and large-capacity edge computing across the communication chain.

In the communication module sector, BIWIN offers highly integrated storage solutions such as eMMC, LPDDR, eMCP, and uMCP, widely used in 5G/4G smart modules, optical network terminals, routers, and set-top boxes. These products support high-bandwidth transmission, concurrent multitasking, and continuous data stream operations. With customized firmware optimizations (e.g., smart caching, direct-write mechanisms, garbage collection, and data encryption) and rigorous testing, the products ensure stable read/write performance and data security in extreme environments. Certified for compatibility with mainstream SoC platforms like Qualcomm, MediaTek, and Unisoc, Biwin’s solutions offer strong system integration and high deployment efficiency.

From Technological Innovation to Full-Stack Products

Building Comprehensive Solutions for Edge AI

With deep technical layout of its "Integrated Solutions and Manufacturing" (ISM), BIWIN is making continuous efforts to promote the coordinated integration of "AI + portable smart terminals". By developing self-owned controllers, BIWIN supports collaborative design in the firmware algorithms with low-power consumption and quick response functionalities. Meanwhile, its excellence in advanced packaging and testing processes gives it a leading edge in meeting the growing demand for high-density, slim and compact storage for edge AI devices. For intelligent automotive clients, BIWIN provides fully localized solutions based on proprietary controllers, and guarantees automotive-grade standards through its years’ expertise in rigorous testing system.

BIWIN’s product portfolio designed for edge AI includes eMMC, LPDDR, UFS, ePOP, uMCP, and eMCP, catering to diverse AI application scenarios. Its LPDDR5/5X memory supports transfer rates up to 8533 Mbps, enabling efficient operation of multimodal AI models in smartphones. The ePOP, with a thickness as low as 0.64 mm and ultra-low power consumption, empowers AI glasses and smartwatches with sleek designs and all-day battery life. Additionally, BIWIN provides large-capacity storage for embodied intelligence and AI education devices, seamlessly supporting user preferences and interaction histories to enable personalized services. For AI PCs, BIWIN addresses the high-compute and massive data processing demands driven by large models, offering high-performance DDR5 overclocked memory and PCIe 5.0 SSDs for high-speed, large-capacity solutions.

52X Strategic Vision

Leading Storage Technology Innovation

With the rapid advancement of cutting-edge technologies such as 6G, artificial intelligence, and autonomous driving, global data volumes are growing exponentially, placing greater demands on storage systems in terms of performance, capacity, and security. With a customer-centric approach, BIWIN remains steadfast in pushing the boundaries of storage technology through continuous innovation. As one of the few companies in the industry with both advanced storage capabilities and wafer-level packaging and testing expertise, BIWIN will center around the "5+2+X" strategic layout to cultivate three core markets, namely mobile phones, PCs, and servers, and also actively expand into emerging areas such as smart wearables and intelligent vehicles. Looking ahead, BIWIN is also making forward-looking investments in future-oriented fields like embodied intelligence and the low-altitude economy. By working hand-in-hand with global partners, the company aims to build a smarter and more efficient digital world and contribute to the high-quality development of China’s storage industry ecosystem.