In response to the trend of edge AI demanding high-performance computing, high integration, and miniaturization, BIWIN has launched its industrial-grade BGA SSD. Within a compact form factor comparable to a five-cent coin (16 x 20 x 1.3 mm), it offers up to 1TB storage capacity and high-speed PCIe 4.0 x4 transmission. The BGA packaging ensures greater reliability in devices subject to frequent movement or mechanical vibrations, making it widely applicable in fields such as edge computing, AI smart boxes, industrial control, smart vehicles, communication equipment, industrial tablets, and entertainment devices.

Covering All AIoT Edge Intelligence Scenarios

Smaller, Stronger, Smarter

BIWIN’s industrial-grade BGA SSD series fully meets the multifaceted storage demands of the edge intelligence era. It not only satisfies the stringent requirements of edge AI computing for high computational power and low latency but also addresses industrial-grade applications’ needs for long lifecycle, multi-interface compatibility, and stable operation under extreme conditions such as temperature and humidity. This provides a robust data storage foundation for diverse intelligent application scenarios.

These SSDs achieve sequential read and write speeds of up to 7,300 MB/s and 4,600 MB/s respectively, with storage capacities ranging from 256GB to 1TB. This flexibility accommodates a wide range of needs, from lightweight embedded devices to high-load edge computing nodes. In terms of environmental adaptability, the product offers three wide-temperature specifications: industrial standard grade (-20°C to 70°C), industrial wide-temperature grade (-40°C to 85°C), and ultra-wide-temperature grade (-40°C to 105°C). These ensure data integrity and reliability in standard industrial environments, harsh outdoor equipment, automotive systems, and high-temperature enclosed spaces.

Advanced Self-Developed Firmware Architecture

Enabling Scenario-Specific Fine-Tuning

BIWIN’s BGA SSDs are equipped with in-house developed firmware, finely tuned for the unique characteristics of BGA form factors. This ensures optimal performance and reliability even under space constraints and stringent thermal conditions.

Intelligent Read/Write Scheduling and GC Optimization:
Minimizing write amplification and redundant erasure to enhance performance and lifespan across edge/endpoint devices, even in outdoor or unattended environments.

Fast Boot Algorithm and Low-Latency Access Mechanism:
Supporting instant boot for industrial tablets, autonomous driving systems, and smart cockpits; enabling efficient task scheduling and real-time processing on automated production lines, and ensuring stable and responsive control systems for high-precision smart manufacturing.

Data Reliability:
Featuring 4K LDPC error correction, end-to-end data protection, and RAM ECC; and combined with wide-temperature support and rigorous testing to ensure data safety and system stability in harsh industrial environments.

Customizable and Broadly Compatible:

Offering specific encryption algorithms, secure boot support, and S.M.A.R.T. monitoring for scenarios requiring high data confidentiality; supporting deep compatibility optimization with various operating systems to enhance overall system performance.

In-House Packaging, Testing, and Manufacturing

Ensuring Rigorous Quality Control and Fast Delivery

BIWIN has mastered mature BGA packaging design and process technology, ensuring excellent electrical performance, signal integrity, and thermal management. Leveraging its comprehensive testing capabilities—spanning hardware development for testing equipment, testing algorithm research, and automated testing platform development—BIWIN conducts stringent industrial-grade reliability tests on its BGA SSDs, including prolonged high-temperature aging, temperature cycling, and vibration testing, so as to ensure high product stability and yield rates.

By achieving vertical integration from R&D design to packaging, testing, and manufacturing, BIWIN has established a robust quality control system while significantly improving production efficiency and delivery reliability. With deep supply chain integration and rapid response mechanisms, BIWIN ensures stable production capacity and efficient delivery schedules. It also flexibly supports small-batch customization to meet specific application scenarios, enabling efficient deployment and continuous innovation in edge intelligence and industrial systems.

Peng Peng, General Manager of BIWIN Spec

“As devices continue to shrink in size, achieving a balance between performance and power efficiency becomes increasingly critical. This trend places higher demands on the integration capabilities of storage products and the technical depth of vendors. BIWIN remains committed to industrial-grade storage R&D and innovation. With full-stack development capabilities—from chip design and firmware algorithms to hardware engineering—combined with advanced packaging technologies and in-house manufacturing, BIWIN exercises strict process control and quality assurance across the entire value chain, from product selection and packaging design to final delivery. This ensures every chip is precisely tailored to meet the complex demands of edge computing and AIoT high-performance scenarios.”