Recently, BIWIN Spec automotive-grade eMMC solutions have garnered multiple prestigious industry honors, including the “Domestic Supply Chain Breakthrough Award 2025” from GaoGong Intelligent Vehicle, the “2024 Automotive Electronics Science and Technology Award (Outstanding Innovative Product)” from the Shenzhen Automotive Electronics Industry Association, and the “2025 Automotive Industry Innovative Product Award” from OFweek. Notably, BIWIN stands as the only storage company named in this year’s GaoGong Intelligent Vehicle Awards, listed together with prominent OEMs and Tier 1 suppliers—a clear recognition of its strength in automotive-grade storage technology, product innovation, and market impact.
BIWIN’s automotive-grade eMMC series includes the TAE308 full-localization solution and the TAE318 compact-capacity solution, designed to meet the diverse requirements of intelligent vehicles—ranging from high-speed data transfer and low latency to superior reliability and domestic substitution. The entire lineup is certified to AEC-Q100 automotive reliability standards, supports operation from -40℃ to 105℃, and offers long-term supply assurance. These features make BIWIN eMMC solutions ideal for applications in intelligent cockpits, autonomous driving, and in-vehicle infotainment (IVI) systems, among other critical use cases.
TAE308 | Full-Localization Solution Unlocking High-Speed Performance
Fully localized architecture: In-house automotive-grade controller, proprietary firmware algorithms, and self-owned packaging and testing ensure a 100% domestically controlled supply chain.
High-speed transmission: 64GB to 128GB capacities with sequential read/write speeds up to 330/220 MB/s, equipped with HS400 high-speed interface for fast response and large data throughput.
Secure and reliable: JEDEC eMMC 5.1 compliant, compatible with mainstream domestic automotive SoC platforms, reinforcing security and trust in the intelligent vehicle ecosystem.
Complete features: Equipped with FFU firmware upgrade, Boot Partition, and RPMB, perfect for complex and vibration-intense in-vehicle environments.
Highly customizable: Proprietary firmware algorithms and performance tuning capabilities tailored for different OEM requirements and application scenarios.
TAE318 | Energy-Efficient Choice for Lightweight Automotive Systems
Flexible capacities: 8GB to 32GB options optimized for cost-sensitive, lightweight automotive systems.
Ultra-low power consumption: Standby current ≤100μA, reducing vehicle static power consumption and extending battery life.
Exceptional reliability: MTBF ≥30 million hours, ensuring long-term stability for critical modules.
Optimized performance: Dedicated boot partitions and firmware tuning accelerate startup and loading times for lightweight applications such as digital instrument clusters, delivering a smoother driving experience.
Broad compatibility: Supporting multiple lightweight automotive OS and mainstream SoC platforms, reducing total cost of ownership (TCO) for system integration.
Typical applications: Intelligent cockpit, IVI systems, central control & navigation, autonomous driving, instrument clusters, T-BOX, and domain controllers.