Recently, an expert panel organized by China Certification & Accreditation Institute (CCAI) paid a visit to Shenzhen BIWIN Storage Technology Co., Ltd. and conducted technical validation based on Automotive-Grade Chip Certification System. Two of BIWIN automotive-grade eMMC chips were technically assessed across critical indicators such as design development, reliability, and electromagnetic compatibility. The review results were rated as “successfully passed”.
Rixin Sun, Founder and Strategic Advisor of BIWIN, welcomed the panel and shared the company’s growth path
This review marks China’s first full-chain, multi-dimensional validation based on the independently developed automotive-grade chip certification system (version 1.0). Led by CCAI, the review was jointly carried out by experts from FAW Group, Institute of Semiconductors (CAS), Changan Automobile, BAIC Group, and Dongfeng Motor Corporation R&D Institute, among other authoritative institutions.
The automotive-grade chip certification system defines the full-chain security and reliability requirements of automotive chips from design, manufacturing, packaging & testing, to in-vehicle application. Through this review, it effectively safeguards chip products meet the stringent quality standards required for automotive applications, providing OEMs with an authoritative basis for product acceptance, quality control, and supply qualification. The expert panel also offered professional recommendations to further enhance BIWIN’s quality management and design direction, helping the company achieve both higher product quality and cost efficiency.
Full-Chain Layout from Design to Manufacturing
Building a Secure and Reliable “China Automotive Solution”
BIWIN has continuously advanced its technology and expanded its layout in the field of automotive-grade storage. With comprehensive strengths in product portfolio and market service, the company has established a complete matrix of automotive-grade storage products, including eMMC, UFS, LPDDR, and BGA SSDs, all fully compliant with AEC-Q100 reliability standards. These products are widely deployed in smart cockpits, autonomous driving systems, T-BOX, domain controllers, instrument clusters, navigation, and in-vehicle monitoring. Today, BIWIN’s automotive-grade products have been successfully adopted by multiple leading OEMs and Tier 1 suppliers in China, ranking among the top domestic brands by shipment volume and continuously powering the safe and reliable operation of intelligent vehicles.
Behind BIWIN’s strategic expansion is its core technical power by the “integrated solutions and manufacturing” strategy. Driven by continuous innovation, BIWIN possesses full-stack in-house expertise ranging from controller design, firmware development, and advanced packaging to intelligent manufacturing. The two automotive-grade eMMC products that passed the national certification review — BWEFMA064GN923 and BWEFMA128GN923 — exemplify BIWIN’s technical strength. This eMMC series achieves 100% localization across controller design, NAND selection, and packaging, delivering a truly secure and controllable “China Chip” storage solution that reinforces the resilience of China’s automotive supply chain.
Chip Design & Solution Development:
Meeting Automotive-Grade Performance Standards
BIWIN’s strong IC design and firmware teams are capable of fine-tuning and customizing firmware to meet the stringent requirements of automotive applications for data integrity and endurance. This allows BIWIN to address diverse customer needs in performance, power efficiency, and compatibility.
The company’s self-developed SP1800 controller supports eMMC 5.1 and HS400 high-speed mode, offering robust parallel data processing capability. With 4K LDPC and SRAM ECC technologies, the controller ensures high reliability and data integrity even under complex automotive operating conditions, meeting the demanding needs of smart cockpit and autonomous driving applications.
Advanced Packaging & Testing and Intelligent Manufacturing
Ensuring Product Consistency and Reliability
As one of the few domestic storage manufacturers with an in-house packaging and testing facility, Greater Bay Advanced Technology (GBAT), a subsidiary under BIWIN, has obtained IATF 16949 automotive quality management certification and mastered advanced technologies such as multi-layer die-stacking and SiP (System-in-Package). The company is also investing in more wafer-level packaging capabilities such as TSV, bumping, and RDL, enhancing thermal performance and long-term reliability for highly integrated automotive chips.
The company also operates a dedicated automotive-grade reliability lab, with rigorous qualification processes covering several international automotive standards such as high-low temperature cycling, thermal shock, pressure cooker testing, salt spray corrosion, mechanical shock, and EMC testing. Each chip undergoes over 1,000 hours of reliability testing, ensuring zero-defect quality from design through mass production.
Conclusion: Deepening Automotive Storage Expertise to Power China’s Smart Mobility
BIWIN automotive-grade storage solutions have gained wide industry recognition, earning awards such as the “2025 Domestic Supply Chain Breakthrough Award 2025” and the “2024 Automotive Electronics Science and Technology Award ”. Looking ahead, BIWIN will continue to strengthen its R&D investment, deepen its “Integrated Solution and Manufacturing” (ISM) strategy, and introduce more high-performance, high-reliability automotive-grade storage solutions, delivering safer, more reliable, and more competitive memory products to empower the next generation of intelligent vehicles in China.