Recently, the 2025 UNISOC Smart Wearable Salon themed “One Wear, One World” was held in Shenzhen. As a key ecosystem partner of UNISOC, BIWIN showcased a full lineup of highly integrated, ultra-compact, high-performance storage solutions tailored for on-device / endpoint AI, including ePOP4x, UFS, LPDDR5X, uMCP, and Mini SSD. The specific scenarios covered encompass smart wearables, AI smartphones, AI PCs, embodied AI, AI education, and more. BIWIN products are already widely adopted by global tier-1 brands including Meta and Google, delivering rock-solid performance foundations for next-gen intelligent terminals.
01 Ultra-Compact High-Performance Storage for On-Device AI: Smaller, Faster, More Power-Efficient
The on-device and real-time trends of AI raise unprecedented strict requirements of the computing power, power consumption, and dimension for terminal devices. In response, BIWIN has launched multiple miniaturized embedded storage solutions to handle these challenges.
ePOP4x: Ultra-thin all-in-one solution for smartwatches & AR glasses
- 8 × 9.5 × 0.6 mmextreme thinness for truly invisible wearing experience
- Heterogeneous multi-die integration (ROM + RAM in one package)
- Up to 4266 Mbpshigh bandwidth for real-time multi-sensor data processing
- Ultra-low power consumptionfor all-day battery life
It enables richer on-device AI experiences, such as real-time health monitoring, environmental awareness, lightweight inference, within slim bodies of smartwatches and smart glasses.
LPDDR5X / UFS / uMCP: Faster memory & larger capacity for AI smartphones
Among them, the LPDDR5X with capacity of 128 GB provides high bandwidth up to 8533 Mbps, perfect for on-device models, 8K video creation, and seamless multitasking.
02 Mini SSD: Named one of TIME’s Best Inventions 2025
BIWIN Mini SSD was recognized as one of TIME Magazine’s Best Inventions of 2025, backed by its innovative system-level packaging technologies. This product stands as the ultimate expandable storage revolution for thin & light devices. Highlights include:
- Half the size of a coin, weighs only 1 g
- Integrated controller + NAND + PMIC in a single package
- 16-layer die-stacking, capacityup to 2 TB
- 3700 MB/s read, 3400 MB/s write
Engineered with an innovative slot-in socket design, it enables an extremely simple plug-and-play expansion experience without any dissembling steps, ideal for AI gadgets, compact industrial PCs, pro creators, offline large-model inference, and massive raw footage storage.
03 High-Performance Storage for AI PCs, Embodied Intelligence & AI Education
Tailored for computing-power-demanding scenarios such as AI PCs, learning machines, robots, and embodied intelligence devices, BIWIN offers more solution options like PC OEM, high-performance embedded memory, and etc.
- OverclockedDDR5 memory
- AP843E PCIe 4.0 SSD
- High-performance BGA SSD
- UFS, LPDDR
These products feature super-fast read/write speeds and large capacities to empower multi-threaded computing, real-time decision-making, and stable training, offering higher performance, lower latency and stronger stability for AI terminals.
04 Deeply Embedded in the Global Intelligent Terminal Ecosystem
In the era of large-scale on-device AI deployment, memory is no longer just about capacity — it has become the core infrastructure that directly determines computing efficiency, power consumption, and user experience. With decades of expertise in firmware algorithms, advanced packaging, and software/hardware development and backed by its Integrated Solutions and Manufacturing capabilities, BIWIN delivers trusted high-performance storage and memory solutions to the world’s most demanding customers.
Multiple BIWIN solutions have passed the strictest qualification processes of Meta, Google, and other global leaders, proven in long-term mass production across smart wearables, smartphones, AI PCs, AIoT, and embodied intelligence.
Looking ahead to the next wave — lightweight models running real-time inference locally, massive data processed at the edge, and terminals evolving into true intelligent agents — BIWIN will continue to push the limits of bandwidth, integration, power efficiency, and long-term reliability.
Together with global partners, BIWIN is committed to building an open, innovative storage ecosystem, accelerating the journey from lab to mass-market, and driving on-device AI toward true universal adoption with stronger technology resilience, stable supply, and forward-looking product roadmaps.