The increasing requirements of wearables such as AI glasses and smartwatches for ultimate thinness and lightness, extended battery life, and advanced multimodal AI capabilitiess are propelling the demands for storage and memory solutions that are more compact, energy-efficient, and high-performing. BIWIN ePOP5x stands as the “small but powerful” solution designed for portable intelligent terminals backed by its ultra-small size, superior efficiency and stable reliability, perfect for thin and light devices to unleash surging AI capabilities.
Dedicated to developing memory solutions for smart wearable devices on a long-term basis, BIWIN is equipped with multi-layer ultra-thin stacking packaging technology and software/hardware R&D capabilities to achieve system-level balance among miniaturization, performance and reliability. To date, BIWIN ePOP series has now been widely applied in flagship wearable devices of several top international brands. The brand-new BIWIN ePOP5x further breaks the limits of performance and dimensions, demonstrating a 25% decrease of power consumption, a 32% reduction of packaging thickness but an 100% increase of overall transfer rates, fully meeting the storage and operation needs of mobile intelligent devices.
Advantages of BIWIN ePOP5x
- Compliant with JEDECstandards, integrating eMMC and LPDDR5X, with a ball pitch of 0.35mm and size of only 8.0×9.5×0.54mm. It can be directly mounted on the main SoC, facilitating extreme thin and light designs and empowering AI wearable devices such as smart glasses and smartwatches.
- The LPDDR5X adopts an ultra-low voltage architecture, with idle state power consumption of only 100μA and I/O voltage as low as 0.3V (when ODT is off). It enables thermal throttling and consumption reduction even in high-load scenarios, avoiding crashes and significantly extending single-charge battery life for mobile devices.
- Built-in error detection and bad block management mechanisms, and RPMB and FFUenabled. It also supports a wide temperature operating environment from -25℃ to +85℃, providing comprehensive protection for data security and long-term stable operation of devices.
- eMMC supports HS400 high-speed mode with a maximum data transferrate of 400MB/s; LPDDR5X has a maximum data transfer rate of 8533Mbps, combined with 16n/32n-bit prefetch architecture, enabling fast content loading and efficient handling of high-frequency tasks.
BIWIN’s ePOP product based on LPDDR5X 201-ball, with advantages such as ultra-small volume, low power consumption, high performance, and high reliability, precisely matches the needs of high-end smart wearables and mobile intelligent devices, comprehensively enhancing device user experience from the storage side.
Ultra-Small Volume
Its compact form factor greatly saves board footprint, supporting lightweight designs for AI smart glasses and high-end smartwatches, while reserving space for integrated layouts in ultra-thin phones and other mobile devices.
Low Power Consumption
Its low power design helps extend device battery life, and reduce heat generation in wearables for improved wearing comfort. Optimized power efficiency during high-load operation of mobile devices alleviates battery anxiety in high-pressure scenarios.
High Performance
It handles high-load tasks for AI glasses, achieves second-level boot-up for high-end smartwatches, meets demands for multi-tasking and high-definition shooting on phones, ensuring an immersive experience for AI intelligent devices.
High Reliability
It ensures stable operation of smart wearable devices, while enhancing drop resistance and anti-aging capabilities for mobile intelligent devices, resisting interference from complex environments and ensuring data security.
BIWIN, through its vertically integrated business model of "solution R&D + advanced packaging and testing manufacturing," not only continuously iterates and optimizes product performance and size but also quickly responds to customer customization needs, achieving deep collaboration from technical pre-research and engineering validation to mass production delivery. The launch of the BIWIN ePOP5x product not only demonstrates BIWIN's technological progress and innovation in the smart wearable field but also provides a "small size + high efficiency" storage solution for mobile intelligent devices.
As AI wearable devices evolve toward even lighter weight and smarter interaction methods, BIWIN will focus on terminal manufacturer customers and user experience, accumulating more core technologies and high-value patents in miniaturized embedded storage. It aims to build a benchmark product system for high-performance, low-power, high-reliability embedded storage in the edge AI era, continuously empowering innovation in the global intelligent terminal industry.