At Embedded World 2026, the world’s leading exhibition for embedded technologies held from March 10–12 in Nuremberg, BIWIN showcased its comprehensive portfolio of storage solutions and core technologies. Among the highlights, BIWIN ePoP5X was honored with the prestigious “Best-in-Show” Award, recognizing its breakthrough innovation and optimized performance for AI edge applications.
Award-Winning Innovation: Redefining Storage for AI Wearables
The “Best-in-Show” Award is one of the most recognized distinctions in the embedded industry, evaluated across multiple dimensions including technological innovation, performance, application adaptability, and market impact.
BIWIN ePoP5X stood out as a benchmark storage solution for AI-powered wearables, delivering an exceptional combination of ultra-compact design, high performance, and reliability.
Leveraging advanced multi-layer ultra-thin stacking technology and vertically integrated hardware and software design capabilities, ePoP5X achieves 32% thickness reduction compared to previous generations, 25% lower power consumption and 2× faster data transfer speeds.
With an industry-leading 8.0 × 9.5 × 0.54 mm form factor, ePoP5X can be directly mounted onto the main SoC, enabling ultra-slim designs for devices such as AI glasses and smartwatches. Its low-voltage architecture and multi-layer protection mechanisms further enhance battery life and ensure stable operation in complex environments.
The BIWIN ePoP series has already been deployed at scale in flagship products from leading global wearable brands.
BIWIN has established a comprehensive storage portfolio spanning edge AI, embedded, consumer, industrial & automotive, and enterprise applications.
Following its earlier recognition at MWC 2026, BIWIN Mini SSD continued to draw strong attention at Embedded World. With its compact form factor, high performance, and modular design, Mini SSD is redefining storage architecture and performance boundaries, supporting lightweight upgrades for next-generation devices such as AI PCs.
In the automotive and industrial sectors: the automotive-grade TAE308 eMMC, powered by BIWIN’s in-house controller, serves as a core storage component for intelligent cockpits and autonomous driving systems.
Industrial-grade wide-temperature PCIe Gen3/Gen4 SSDs and in-house controller-based eMMC solutions are engineered for harsh environments, delivering high endurance and large capacity to ensure 24/7 data reliability in applications such as smart factories and 5G infrastructure.
Technology Foundation: Integrated Solutions and Manufacturing
BIWIN continues to strengthen its integrated solutions and manufacturing capabilities across IC design, firmware, and advanced packaging, building a full-stack synergy tailored for the AI era.
Through sustained investment in in-house controller development, BIWIN achieves optimized co-design of controller and firmware, enabling breakthroughs in low power consumption, fast response, and system-level efficiency. Meanwhile, the integration of advanced packaging processes allows systematic optimization of product dimension, performance, and energy efficiency.
This approach enables BIWIN to meet the evolving demands of AI applications, including high capacity, high energy efficiency, and compact form factors, while supporting rapid customization and agile innovation.
BIWIN’s self-developed SP1800 eMMC controller has entered mass production and is already deployed in automotive-grade storage solutions. The company has also achieved maturity in 16-layer ultra-thin die stacking and 30μm–40μm ultra-thin process technologies. Through its wafer-level advanced packaging and manufacturing projects, BIWIN is accelerating the mass production of WLP technologies such as Chiplet, Fan-out, Fan-in, and bumping. These integrated capabilities enable rapid development and deployment of innovative storage solutions tailored to emerging AI-driven applications.
Looking Ahead: Building Full-Stack Competitiveness in the AI Era
As multimodal AI models drive exponential growth in compute demand, the storage and advanced packaging industries are entering a new phase of opportunity. Competition is evolving from single-point technologies to end-to-end capability ecosystems. BIWIN will continue to advance its integrated solutions and manufacturing strategy, accelerate iteration of in-house controllers, expand advanced packaging capacity and further focus on key growth areas including edge AI, intelligent vehicles, and embodied AI. By building a full-stack capability spanning controller ICs, innovative storage design, and advanced packaging, BIWIN aims to empower the global intelligent ecosystem and drive high-quality growth for the semiconductor storage industry.