At the opening day of the 2026 Beijing International Automotive Exhibition (Auto China 2026), BIWIN officially unveiled its next-generation automotive-grade UFS 3.1, designed to meet the surging performance and reliability demands of AI-powered vehicles. As large AI models accelerate their deployment in automobiles, storage/memory are under unprecedented standards to enable vehicle-mounted applications such as 8K in-cabin entertainment, real-time HD map rendering, multimodal AI interaction, and L3+ autonomous driving. BIWIN’s latest solution addresses these challenges head-on.
The BIWIN TAU208 automotive UFS 3.1 integrates the company’s full-stack expertise in controller design, firmware algorithms, and advanced packaging and testing. Delivering up to 23.2Gbps bandwidth and compliant with AEC-Q100 Grade 2 standards, TAU208 acts as a “fast and resilient data engine” for intelligent vehicles, well-suited for applications including smart cockpit, autonomous driving, in-vehicle infotainment, digital clusters, and central control systems.
01 High Bandwidth and Low Latency for In-Vehicle AI Workloads
As AI models become central to vehicle intelligence, enabling closed-loop “perception–decision–execution” systems across domains such as driving, cockpit, and chassis, storage/memory directly impacts inference speed and system responsiveness.
Built on the UFS 3.1 standard, TAU208 adopts an MPHY 4.1 and UniPro 1.8 protocol. Its dual-lane (2-Lane) architecture enables a theoretical bandwidth of up to 23.2Gbps. According to BIWIN lab test data, the product achieves sequential read and write speeds of up to 2150MB/s and 1650MB/s respectively, while random read/write performance exceeds 300K IOPS. Compared with traditional eMMC solutions, overall read/write performance is improved by more than 6 times, significantly reducing transfer latency and enabling high-speed data access for ADAS, domain controllers, and cockpit HMI systems. Whether supporting real-time HD map updates, rapid AI voice assistant wake-up, or fast loading of in-vehicle entertainment content, TAU208 delivers a highly responsive and seamless user experience.
02 Automotive-Grade Reliability from Design to Manufacturing
Given the complexity of automotive environments, reliability and durability are mission-critical. Leveraging automotive-grade product design, manufacturing and supply chain management, BIWIN TAU208 UFS 3.1 delivers excellent stability and durability, building the foundation for reliable high-speed driving.
At the design stage, the product incorporates high-quality NAND and is optimized with advanced firmware and hardware and software tailored for automotive use cases. It supports an ultra-wide operating temperature range from -40°C to +105°C, ensuring stable performance under extreme conditions. Furthermore, TAU208 has successfully passed AEC-Q100 Grade 2 certification.
In packaging and manufacturing, BIWIN’s self-built advanced manufacturing facility has been certified to the IATF 16949 automotive quality management system. In addition, the manufacturing center supports top-notch packaging technologies such as 16/32-layer die-stacking, 30μm–40μm ultra-thin die, and heterogeneous multi-chip integration, ensuring both performance and manufacturing consistency.
BIWIN also operates a dedicated automotive-grade test laboratory with a rigorous test system covering the entire product lifecycle. TAU208 UFS 3.1 is assessed with over 1000 hours of reliability certification, including international standards like thermal cycling, thermal shock, high-pressure stress testing, salt spray corrosion, mechanical shock, and EMC compliance. It also achieves a MTBF exceeding 30 million hours and a lifespan of over 5 years. In addition, BIWIN has signed long-term agreements (LTAs) with leading global wafer foundries to ensure stable and continuous supply.
03 Advanced Data Protection with Intelligent Firmware
To safeguard data integrity and system stability, BIWIN has developed a comprehensive set of proprietary firmware-level protection mechanisms tailored for automotive applications.
TAU208 is engineered with built-in LDPC-based ECC along with NAND-level redundancy, which provides dual-layer data protection to ensure data integrity even under intensive, long-term read/write operations. Its exclusive Performance Throttling Notification feature dynamically adjusts performance based on temperature conditions, preventing excessive wear and reducing error rates caused by thermal stress. Additionally, the built-in Error History function enables detailed tracking of operational anomalies, supporting predictive maintenance and system diagnostics. Together, these features create a robust framework for both data security and system health management.
04 Energy-Efficient Design for Extended EV Range
To address the stringent energy efficiency requirements of electric vehicles, TAU208 introduces an advanced Deep Sleep Mode. In standby or power-off states, power consumption can be reduced by up to 95%, significantly minimizing leakage and extending overall vehicle range.
The product also incorporates intelligent thermal throttling and health management systems. Its exclusive Performance Throttling Notification feature supports real-time monitoring of die temperature and dynamic adjustments of performance to prevent frequency reduction due to overheating; while the Error History helps provide data support for after-sale failure analysis, shifting maintenance from reactive to proactive.
05 Conclusion
With its 23.2Gbps ultra-high bandwidth, advanced ECC, and innovative low-power design, BIWIN’s automotive UFS 3.1 delivers stable, secure, and high-performance data support for next-generation intelligent vehicles. This launch underscores BIWIN’s continued advancement in automotive storage technologies and its expanding presence in the automotive market.
BIWIN now offers a comprehensive automotive product portfolio, including LPDDR, eMMC, UFS, BGA SSD, and memory cards. And its products have secured volume shipments with over 20 leading OEMs and Tier 1 suppliers. Notably, BIWIN automotive-grade eMMC successfully passed the technical validation based on Automotive-Grade Chip Certification System organized by China Certification & Accreditation Institute (CCAI), becoming one of the only two storage vendors included on the whitelist.
Looking ahead, BIWIN will continue to expand its footprint in the automotive sector—targeting full coverage of top domestic OEMs, accelerating large-scale eMMC deployment, and driving UFS adoption in mid-to-high-end applications. By strengthening its vertically integrated ecosystem spanning controller, firmware, and packaging, BIWIN remains committed to delivering secure, reliable, and high-performance automotive-grade storage solutions.