At the end of April, Shenzhen celebrated the International Workers’ Day and meanwhile held a commendation conference for model workers and advanced collectives. In recognition of its achievements in semiconductor storage innovation, market expansion, industrial contribution, talent development, and corporate social responsibility, BIWIN was included in the list of honorees and jointly awarded the title of “Shenzhen Advanced Collective 2025” by the Shenzhen Municipal Committee of the Communist Party of China and the Shenzhen Municipal People’s Government.
This inclusion in the list of “Advanced Collectives 2025”, as the only semiconductor storage and memory solutions provider listed, marks a recognition of BIWIN’s endeavors in critical technologies, industry breakthroughs, and talent development, as well as its contribution to the high-quality growth of semiconductor industry in Shenzhen.
Positioned as a semiconductor storage and memory solutions provider for the AI era, BIWIN has established a complete technical roadmap covering storage media characterization research, firmware algorithm development, controller design and advanced packaging and testing, guided by the company’s “integrated solutions and manufacturing” strategy. Backed by the technological system, BIWIN has achieved mass production and delivery of its self-developed eMMC controllers, with critical layouts in 16/32-layer die-stacking, 30μm–40μm ultra-thin die, heterogeneous multi-chip integration and wafer-level advanced packaging technologies such as 2.5D, FOWLP, and FIWLP. The company has integrated capabilities across high-performance memory solutions and wafer-level packaging services.
Furthermore, BIWIN is making concrete efforts in advancing memory-compute co-package technology, in order to satisfy the exponentially growing demands for high-performance computing and memory solutions featured with high bandwidth, large capacity, high density and low power consumption. To ensure stable supply chain, BIWIN had also signed long-term supply agreements (LTA) with IDMs, enabling it to provide high-performance, highly reliable, and customized solutions for customers across global intelligent mobile and edge AI devices, PC and enterprise storage, automotive electronics, and industrial applications.
BIWIN has secured a leading role in key areas such as embedded memory, edge AI memory and more. According to Frost & Sullivan, BIWIN is now the world’s only independent memory solutions provider that boasts wafer-level packaging capabilities. Among the publicly listed independent memory solutions providers, BIWIN ranked 2nd in the embedded memory market, and secured the No.1 place in emerging edge AI market worldwide, with revenue in related business reaching RMB 1.751 billion in 2025 and CAGR ranking top in the industry.
Driven by its vertically integrated industrial layout and proprietary technology innovation, BIWIN continues to accelerate its growth momentum, achieving substantial progress across products, technologies, and business performance.
Product Highlights: Strengthening Leadership in Emerging Edge AI and High-End Markets
Mini SSD, the company’s innovative miniaturized product, has gained industry-leading influence with several international recognitions, including the TIME Best Inventions of 2025, Embedded World 2025 Best-in-Show, MWC 2026 Best-in-Show, CES 2026 TWICE Picks Awards, Edison Awards Bronze 2026, and 2026 China IC Design Awards for “Memory of the Year.” The product has already been applied in AI PCs and handheld gaming devices across multiple brands comprising ONEXPLAYER, GPD, and Waterworld. In addition, BIWIN is joining with leading ecosystem partners including Intel, Longcheer, BYD Electronics, and Luxshare to accelerate Mini SSD ecosystem development in areas such as standard compatibility, technical adaptation, and solution integration.
ePoP, the company’s ultra-thin stacked memory solution, is engineered with ultimate integration and superior performance, widely used in flashship smart wearables from leading brands of Google, Meta, Xiaomi, and Rokid. The new-generation edition, ePoP5X, delivers ground-breaking performance and form factor, specifically a 100% increase in transfer rates, a 32% reduction in dimensions and a 25% decrease in power consumption compared with the previous generation. These breakthroughs earned the product the Embedded World 2026 “Best-in-Show” award in the embedded systems category.
While expanding its reach in consumer electronics and edge AI markets, BIWIN is also actively accelerating expansion into emerging sectors such as intelligent automotive systems. At the Auto China 2026, the company launched its next-generation automotive-grade UFS 3.1 solution, which offers bandwidth up to 23.2Gbps, read/write speeds more than 6 times higher than traditional eMMC solutions, and reliability standards certified with automotive-grade AEC-Q100 Grade 2. This product is designed to support high-performance and high-reliability storage requirements for advanced intelligent cockpit and autonomous driving applications, including 8K in-vehicle entertainment, real-time HD map rendering, multimodal AI interaction, and L3+ autonomous driving data processing.
Technology Highlights: Expanding Investment in IC Design, Firmware Development, Solution and Advanced Packaging and Testing. In 2025, the company’s research and development investment totaled RMB 632 million, representing a year-on-year growth of 41.34%; and it obtained 521 global patents and 66 software copyrights.
Self-developed UFS controllers have completed tape-out in February 2026, designed for scenarios such as AI smartphones, AI smart wearables, and autonomous driving with high-end memory solutions.
Its advanced wafer-level packaging facility in Songshan Lake, Dongguan, has entered production at the end of 2025. Its monthly capacity is planned to reach 5000 wafers by the end of 2026 and 10,000 wafers by the end of 2027. The expanding production capacity will support the company in seizing opportunities arising from rapid AI computing growth.
Business Performance: Demonstrating Strong Product Competitiveness and Market Potential. Following its strong 2025 performance, during which BIWIN achieved revenue of RMB 11.302 billion and a 429.07% year-on-year increase in net profit, the company maintained rapid growth in Q1 2026, recording operating revenue of RMB 6.814 billion, up 341.53% year-on-year.
The rapid growth of BIWIN is rooted in its comprehensive R&D systems, professional talent development and sustainable ecosystem backed by its “Integrated Solutions and Manufacturing” strategy. Inside the company, BIWIN has established a a structured talent development framework and long-term incentive programs including equity incentives, enabling employees at all levels to share in the company’s growth while building clear career development pathways. Beyond the business operations, BIWIN attaches great importance to corporate social responsibilities especially in promoting industry-academia collaboration. The company has set up “BIWIN Scholarship” with Southwest Jiaotong University and signed a joint talent development agreement with Xidian University to support the development of highly skilled semiconductor talent.
Looking ahead, BIWIN will continue to deepen its “Integrated Solutions and Manufacturing” strategy and accelerate the development of full-stack technology capabilities. Rooted in Shenzhen and serving the global market, the company will further increase investment in R&D and industrialization. Leveraging key industry chain capabilities including memory solutions, controller IC design, and advanced packaging and testing, BIWIN will continue driving industrial innovation while strengthening talent development and fulfilling its social responsibilities, contributing sustained momentum to the development of a world-class integrated circuit industry hub in the Guangdong-Hong Kong-Macao Greater Bay Area and supporting Shenzhen’s “20+8” strategic emerging industry cluster initiative.