At the recently concluded 2026 Beijing International Automotive Exhibition themed “Future of Intelligence”, BIWIN showcased its complete automotive-grade product portfolio, ecosystem solutions and latest technical achievements tailored for smart vehicles.
Automotive Memory Solutions Lineup Debuts, Covering Full-Scenario Applications of Smart Vehicles
At the Auto China 2026, BIWIN unveiled its full-spectrum of automotive-grade products including eMMC, UFS, BGA SSD, and SD Card/microSD Card. The company’s automotive lineup is fully certified with AEC-Q100 standards, and supports a wide range of temperature from -40℃ to +105℃, perfect for smart cockpit, autonomous driving, Internet of Vehicles (IoV), domain controllers, navigation and in-vehicle monitoring.
In market applications, BIWIN has entered the supply chain of over 20 leading domestic mainstream OEMs and Tier 1 suppliers, with shipments ranking among the top domestic vendors. The company is accelerating the vehicle-level validation and scale introduction of next-generation high-bandwidth and large-capacity UFS and BGA SSD products, further expanding its footprints in the factory-installed market.
Brand-New UFS Debuts with 6× Higher Performance Compared with eMMC
In face of the massive deployment of AI models in vehicle-mounted applications, 8K in-vehicle infotainment and L3 advanced driver assistance systems, BIWIN offers its fire-new automotive UFS with model name of TAU208. Based on M-PHY 4.1 and UniPro 1.8, TAU208 operates in a 2-Lane architecture, and delivers theoretical bandwidth up to 23.2Gbps. Test data shows its sequential read/write speeds reaching up to 2150MB/s and 1650MB/s respectively, random read/write performance exceeding 300K IOPS, and overall performance improved by 6 times than eMMC.
In addition, the product has been validated through 1000+ hours of tests including extreme temperature cycling, thermal shock, mechanical impact and EMC, with an MTBF exceeding 30 million hours. Its built-in data protection strategies such as LDPC-based ECC and NAND Redundancy and exclusive Performance Throttling Notification help ensure the data integrity and lifespan under intensive workloads. The equipped Deep Sleep Mode reduces device’s standby power consumption by 95%, improving energy efficiency and extending vehicle range.
Honored with “Annual Influential Automotive Chip”, Shining at the “China Chip Exhibition Zone”
During the Auto China 2026, BIWIN also showed up at the especially-arranged “China Chip Exhibition Zone”. Simultaneously, the “2026 China Automotive Chip Industry Innovation Achievement” held by “China Automotive Chip Industry Innovation Strategic Alliance” was unveiled.
The awards evaluated products based on technological advancement, innovation capability, market performance, and customer recognition, with participation from automotive OEMs and automotive electronics enterprises. BIWIN’s fully domestic automotive-grade eMMC solution featuring an in-house developed controller was honored with the “2026 Annual Influential Automotive Chip” award, recognizing the company’s self-developed core technologies and large-scale mass production capabilities.
BIWIN Automotive-Grade eMMC
This award-winning product comes equipped with data protection mechanism of 4K LDPC and SRAM ECC, and balances high reliability and domestic security and controllability. Notably, this eMMC edition successfully passed the technical validation based on Automotive-Grade Chip Certification System organized by China Certification & Accreditation Institute (CCAI), and has been adopted by multiple OEMs and core Tier 1 suppliers. This product has also been widely recognized by several industry awards, including the “Domestic Supply Chain Breakthrough Award 2025” from GaoGong Intelligent Vehicle, the “2024 Automotive Electronics Science and Technology Award (Outstanding Innovative Product)” from the Shenzhen Automotive Electronics Industry Association, and the “2025 Automotive Industry Innovative Product Award” from OFweek.
Partnering with Ecosystem Leaders to Deliver Multi-Scenario Automotive Storage Solutions
At Auto China 2026, BIWIN collaborated with multiple leading ecosystem partners to jointly showcase storage solutions covering intelligent cockpit systems, in-vehicle infotainment, autonomous driving, and vehicle surveillance applications. Its solutions are broadly compatible with mainstream intelligent cockpit SoC platforms, ensuring smooth multi-tasking system performance. Its high-capacity automotive-grade storage products work in synergy with leading autonomous driving AI chips to support real-time perception fusion and planning-control requirements. Meanwhile, BIWIN’s high-endurance, wide-temperature automotive-grade memory cards and eMMC products are optimized for vehicle surveillance systems, ensuring data integrity and traceability for critical recordings.
BIWIN Automotive Storage Solutions
Currently, BIWIN automotive-grade products have completed technical adaptation and joint validation with mainstream industry computing platforms, enabling the company to provide OEMs and Tier 1 suppliers with one-stop reference solutions featuring hardware-software co-optimization and rapid mass-production deployment.
By continuously integrating ecosystem resources across the automotive value chain, BIWIN is expanding the application boundaries of automotive storage technologies and collaborating with partners to build a safer, smarter, and more efficient automotive electronics storage ecosystem.
Conclusion
As the automotive industry evolves from “functional vehicles” to “intelligent vehicles,” the continuous advancement of electronic and electrical architectures is bringing automotive-grade storage technologies from behind the scenes to center stage.
BIWIN will continue to focus on technological innovation and deepen its integrated strategy combining R&D, packaging, and testing capabilities. Leveraging its full-stack in-house development expertise, BIWIN is committed to building a solid data foundation for intelligent vehicles and contributing to the global transformation toward automotive intelligence.