The Next Generation DDR5 Will Show a 300% Increase in Density¹ and 163% Increase in Speed¹, And Less Power Consumption

¹ Compared to DDR4

This New Year brings a new generation of Double Data Rate (DDR) SDRAM as BIWIN launches its DDR5, an early market entry as PC, CPU and motherboard makers will gear up later in 2022 for the latest generation of PC computing.

BIWIN Storage DDR5 UDIMM

Welcome to the Beginning of the DDR5 Era

With this new generation, PC computing gains a significant boost in performance.

DDR5 is the fifth-generation DDR SDRAM and the enhancements from DDR4 to DDR5 are the greatest ever. This transition-- from DDR4 to DDR5-- is much more than a typical DDR SDRAM generational change as DDR5 takes rates a big jump forward by overhauling the DDR architecture to increase bandwidth. While previous generations focused on reducing power consumption (spurred by applications such as mobile and data center), DDR5's biggest driver has been fulfilling our need for more bandwidth.

Compared to DDR4 at an equivalent data rate of 3200 mega transfers per second (MT/s), experts show DDR5 system-level simulation indicates an approximate performance increase of 1.36X effective bandwidth. At a higher data rate, DDR5-4800, the approximate performance increase becomes 1.87X—nearly double the bandwidth as DDR4-3200.

Built with the latest 1Znm 16Gb DDR5 ICs from Micron, BIWIN DDR5 U-DIMM reaches 4800 MBps, easily exceeding the highest expected performance of DDR4. For this early stage of DDR5, as PC makers catch up with compatible components, BIWIN Storage Technology will provide customers with the options of 16 GB and 32 GB.

In addition to enhancing performance, BIWIN DDR5 UDIMM features the characteristics of RAS (reliability, availability, and serviceability).

One-die ECC Correction Mechanism

Drawing from data correction experiences in industrial control and enterprise applications, the one-die ECC correction mechanism will now be a platform for daily users. It can run independently, reducing the burden on the controller, and offering end-to-end protection during the data transmission.

WR Balance of Read-in Data

This function helps prevent signal interference but also allows for a higher read-in data ratio.

PMIC Management of Power Supply

Highly efficient in controlling the power supply loading, adjusting the power supply ripple, managing the voltage, and governing the up/down timing, PMIC Management reinforces the signal while its low working voltage of 1.1 V reduces heat and saves on electricity.

Data CRC

BIWIN DDR5 supports data Cyclic Redundancy Check (CRC) for write and read data, ensuring high-speed, high-accuracy, low-cost correction-- and avoiding channel malfunctions.

BIWIN DDR5, Lightning-speed Computing

BIWIN Storage takes the early initiative to roll out its DDR5 UDIMM memory stick, but more innovation will follow as the DDR5 gradually, throughout most of 2022, becomes the standard in the PC component system (instead of impressive new memory technology forced to wait for the other components to catch up before it can be adopted by the mainstream).

BIWIN Storage DDR5 UDIMM

In the near future, BIWIN plans to roll out its DDR5 SODIMM version and a DDR5 series products with Samsung ICs. As a full-service provider for storage chips, BIWIN will build DDR5 not only for premium PCs but also for various scenarios, including eSports computers, data centers, AIoT applications, and artificial intelligence use cases.

INNOVATIVE SOLUTIONS IN STORAGE

BIWIN Storage Technology Company Limited ("BIWIN") produces high-quality flash storage and memory-- and is known in consumer, corporate and industrial segments for its independent development capabilities in hardware, software, firmware, and storage algorithms.

BIWIN's experience in production (also along with its complete in-house IC packaging, testing, and SMT production lines) ensures BIWIN products are superior in performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage and memory products. The company's latest facility, the BIWIN Huizhou Science and Technology Campus, features a state-of-the-art R&D lab and 110,000 ㎡ of production.

Email: marketing@biwin.com.cn

Product line: embedded memory chip, USB storage module, memory card, solid-state drive, package testing

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