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BIWIN Half Slim SSD(image 1)
BIWIN Half Slim SSD(image 2)
BIWIN Half Slim SSD(image 1)
BIWIN Half Slim SSD(image 2)
BIWIN Half Slim SSD

Slim 36I1-D

BIWIN’s Half Slim SSD supports SATA III II6GB/s interface and has a temporary storage function of DDR3 DRAM; it adopts powerful control chips, greatly boosting the reading and writing speed, which is not only capable of effectively shortening the system booting up time, but is also able to speed up the data transmission and the initiating speed of commonly used programs. BIWIN Half Slim SSD is light and slim in size, but it can bring out a powerful performance and excellent reliability equal to that of 2.5-inch SSD, which is most suitable for embedded systems with limited space.


Feature

1. Capacity: SLC / MLC: 32 GB - 128 GB; SLC / pSLC / MLC: 32 GB - 1 TB

2. Interface: SATA II, 3.0Gb/s / SATA III, 6.0Gb/s

3. SATA7+15, JEDEC MO-297 Standard

4. Supports Dynamic Power Management

5. Supports Trim, NCQ, S.M.A.R.T.

6. Supports Global Wear Leveling

7. Supports Active and Passive Garbage Collection

8. Supports Quick Erase


Specifications

Product specifications
Model Slim 36I1-D SSD
Interface SATA III
Flash Type MLC
Capacity 32GB - 2TB
Channel 4
Max. Sequential Read / Write 520 / 420 MB/s
Power Consumption 6 W (5V x 1.2A )
Thermal Sensor Support
External Cache Support
Firmware Backup
TRIM Support
ATA Encryption Support
S.M.A.R.T Monitoring Support
AES 256-Bit Optional
Power-off Protection Optional
Quick Erase Optional
Physical Destruction Optional
Working Temperature Standard Grade (0°C - 70°C)/ Wide Grade (-25°C - 70°C)/Industrial Grade (-40°C - 85°C)
Environment Temperature Vibration:20G @7-2000Hz ; Shock:1500G @0.5ms Storage Temperature:-55°C - 95°C MTBF:>3 million hours  
Dimensions 54 X 39 X 4 mm
Application In-vehicle / Healthcare / Notebook
Technical Features Wide Temperature / Underfill / AES Encryption / Firmware Backup / Anti-Sulfuration / Wear Levelling / Direct Write / Garbage Collection & TRIM / Anti-Vulcanization Technology / Thermal Throttling