BIWIN’s enterprise-level PCIe NVMe SSD is equipped with a master control with 8 flash memory channels, and the transmission bandwidth of the interface is PCIe 3.0(8Gb/s)x4 which supports the latest NVMe 1.3 protocol. Adopting 3D NAND flash chips, it has better stability, and used together with the LDPC error correction algorithm, its durability is increased several times. Supports End-to-End Data Protection and SRAM ECC functions, and the power protection circuit and super capacitor are added to prevent data loss in case of abnormal power failure. It is designed to match server chassis with multiple PCIe slots and possesses a better scaly cooling metal design, which is to be applied in enterprise data centers and cloud computing.
| Model | AIC PCIe 33S1/33I1 |
|---|---|
| Interface | Add-in-card PCIe G3X4/NVMe1.3 |
| FLASH Type | TLC |
| Capacity | 120GB~2TB |
| Channel | 8 |
| Seq. Read/Write(MB/s,Max) | 3064/1763 |
| Power Consumption | 7.2W(12Vx600mA） |
| Thermal Sensor | Support |
| External Cache | Support |
| Firmware Backup | Support |
| TRIM | Support |
| ATA Encryption | Support |
| S.M.A.R.T Monitoring | Support |
| AES 256-Bit | Optional |
| Power-off Protection | Support |
| Quick Erase | — |
| Physical Destruction | — |
| Working Temperature | 0~70℃ |
| Environment Temperature | Shock:20G@7~2000Hz/Impact:1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF:>3 million hours |
| Size | 180.00 x 115.00 x 20.00mm |
| Application | Server Storage / Monitor |
| Technical Features | Underfill / AES Encryption / Firmware Backup / Anti-Vulcanization Technology / Wear Levelling / V-REC / Garbage Collection&TRIM / End-to-end Data Protection / Anti-Vulcanization Technology / Thermal Sensor |
