Stock Symbol: 688525 Search CN
Home > Products > Embedded Products > Embedded Storage > BIWIN Flagship eMCP
BIWIN Flagship eMCP(image 1)
BIWIN Flagship eMCP(image 1)
BIWIN Flagship eMCP

eMCP

Smart terminal storage solution featuring higher performance and larger capacity

Product specifications
Interface eMMC: eMMC 5.0 / eMMC 5.1
LPDDR: LPDDR 4 / LPDDR 4x
Dimensions 11.50 × 13.00 mm
Max. Sequential Read eMMC 5.0: 130 MB/s
eMMC 5.1: 300 MB/s
Max. Sequential Write eMMC 5.0: 50 MB/s
eMMC 5.1: 160 MB/s
Frequency LPDDR 4 / LPDDR 4x: 1200 MHz - 1866 MHz
Capacity 32 GB + 8 Gb / 32 GB + 16 Gb / 32 GB + 24 Gb / 32 GB + 32 Gb
64 GB + 16 Gb / 64 GB + 24 Gb / 64 GB + 32 Gb / 64 GB + 48 Gb
128 GB + 24 Gb / 128 GB + 32 Gb
Working Voltage eMMC 5.0 / eMMC 5.1: VCC=3.3 V, VCCQ=1.8 V
LPDDR 4: VDD1=1.8 V, VDD2=VDDQ=1.1 V
LPDDR4x: VDD1=1.8 V, VDD2=1.1 V, VDDQ=0.6 V
Working Temperature -25 ℃ - 85 ℃
Approved Verification Platforms MediaTek: MT6761, MT6762…
Packaging FBGA254
Application In-vehicle / Gaming / Smart Phone