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2022.03.11
BIWIN ePOP Chips Enables Smart Wearables Innovation

BIWIN ePOP Chips Enables Smart Wearables Innovation

Author:BIWIN

The Apple M1 chip has a prominent edge for its superior performance per watt. It can stack up against the peak performance of competitive PC processors via using only one-quarter of its power consumption. With the advanced manufacturing processes,

2022.02.24
BIWIN Launches EP400 to Lead PCIe 4.0 Era

BIWIN Launches EP400 to Lead PCIe 4.0 Era

Author:BIWIN

EMMC and UFS are mainly used in intelligent mobile terminals. They call for proper capacity and performance and are stringent on power consumption and volume. SSDs are principally utilized in PCs and servers, requiring large capacity (100 GB to TB level), extremely high concurrency to improve performance

2022.02.14
BIWIN Infuses Life into PC OEM with PCIe M.2 SSD

BIWIN Infuses Life into PC OEM with PCIe M.2 SSD

Author:BIWIN

The PC OEM market has always been a crucial battlefield for memory manufacturers. In 2021, regarding consumer SSDs, the PC OEM market boasted the largest shipments, accounting for about 62%. In Q1 of 2022, Intel's next-generation Alder Lake processor shipments did not live up to the expectation

2022.01.12
BIWIN DDR4 RDIMM RD100 Finally Obtains the AVL Certification from Intel

BIWIN DDR4 RDIMM RD100 Finally Obtains the AVL Certification from Intel

Author:BIWIN

BIWIN RD100 series DDR4 RDIMM server memory modules with the capacity of 32 GB and 16 GB have passed the AVL certification of Intel Authorized Laboratory.

2021.12.27
BIWIN PCIe BGA SSD: A Scheme for Ideal Size and Superior Storage

BIWIN PCIe BGA SSD: A Scheme for Ideal Size and Superior Storage

Author:BIWIN

In pursuit of the extremely slim feature, traditional mobile intelligent terminals generally adopt eMMC/UFS embedded memory. Two-in-one computers, Ultrabooks and more are defined to production tools. Given that, eMMC is blamed for performance bottleneck, UFS is blamed for limited application platforms, and ordinary SSDs are blamed for large size and high power consumption. Meanwhile, these headaches have engendered the BGA SSD equipped with the PCIe standard interface.

2021.12.16
BIWIN Invites You to Visit the 18th China Public Security EXPO

BIWIN Invites You to Visit the 18th China Public Security EXPO

Author:BIWIN

BIWIN C1004 is compliant with car-level standards, featuring superb quality, outstanding performance, and high durability. At present, it has been stably supplied to many important domestic car manufacturers.

2021.11.19
BIWIN ePOP E100 wins "Memory of the Year"

BIWIN ePOP E100 wins "Memory of the Year"

Author:BIWIN

BIWIN wins the World Electronics Achievement Award "Memory of the Year" for its memory chip ePOP E100 at the 2021 Global CEO Summit.

2021.10.20
BIWIN Launches DDR5 for the New-gen of PC Computing

BIWIN Launches DDR5 for the New-gen of PC Computing

Author:BIWIN

This New Year brings a new generation of Double Data Rate (DDR) SDRAM as BIWIN launches its DDR5, an early market entry as PC, CPU and motherboard makers will gear up later in 2022 for the latest generation of PC computing.

2021.10.17
Chinese Flash Memory Manufacturer BIWIN Debuts at Gitex 2021

Chinese Flash Memory Manufacturer BIWIN Debuts at Gitex 2021

Author:BIWIN

BIWIN brings a full range of industrial storage products such as automotive series and embedded SSDs, as well as its own consumer brand Biwintech series products to Gitex 2021, bringing the latest storage solutions to global customers.

2021.04.25
BIWIN Rolled out Its Vehicle Storage on CITE 2021

BIWIN Rolled out Its Vehicle Storage on CITE 2021

Author:BIWIN

The recent days witnessed the grand show of 2021 CITE in Shenzhen Convention Center. BIWIN made a wonderful debut with the theme of "vehicle storage, leaded by chips", and multi-dimensionally showcased its various storage schemes for vehicle applications. Exhibits are mainly vehicle series products such as C1004

2020.02.27
BIWIN Made its Debut for the Embedded World 2020

BIWIN Made its Debut for the Embedded World 2020

Author:BIWIN

The Embedded World in Nuremberg of Germany is one of the important annual events in the embedded-system industry and the largest embedded exhibition around the world. This year also witnessed the sixth consecutive participation of BIWIN. At this exhibition, BIWIN demonstrated its comprehensive storage solutions and advanced SiP-based packaging and testing services to experts and global customers.

2020.02.12
BIWIN Storage Technology Authorized By Huawei for NM Cards

BIWIN Storage Technology Authorized By Huawei for NM Cards

Author:BIWIN

BIWIN Storage Technology Authorized By Huawei for NM cards, Black Technology Products Serve Huawei’s High-End Smartphone Users

2020.02.12
BIWIN Gets NM Card License From Huawei

BIWIN Gets NM Card License From Huawei

Author:BIWIN

In recent times, Huawei, the creator of the NM memory card, and BIWIN, a leading brand of memory chips in China, jointly signed a patent license for the NM memory card. BIWIN is gearing up for the production and sales of NM memory cards and contributes to the prosperity of the NM memory card ecosystem.

2020.02.10
Win-Win Outcome: BIWIN Entered into Strategic Partnership with INNOGRIT

Win-Win Outcome: BIWIN Entered into Strategic Partnership with INNOGRIT

Author:BIWIN

In August 2019, the Flash Memory Summit (FMS) witnessed the new arrival PH001 AIC SSD from BIWIN. Such a product embodies the latest achievement of our cooperation with INNOGRIT. It houses a PCIe Gen 4 x 4 interface, NVMe 1.4 protocol with a capacity of up to 32 TB and a maximum sequential read speed of over 7 GB/s

2019.11.08
Professional Storage that Accurately Covers the “End” Needs of Security Clients

Professional Storage that Accurately Covers the “End” Needs of Security Clients

Author:BIWIN

The wave of urbanization in China has caused an increasing demand for security products, such as smart cities, smart transportation, etc. In the security industry itself, with new technologies, like artificial intelligence, computer vision, AR/VR, biometrics, big data etc., being continuously integrated with security technologies like ultra-high definition, thermal imaging, low illumination, panoramic surveillance, infrared detection etc., application scenarios are constantly being segmented and increasingly “fragmented”; which presents higher demands on the durability and environmental adaptability of storage devices.